PIC16LC62A-04/SO Microchip Technology, PIC16LC62A-04/SO Datasheet - Page 303
![IC MCU OTP 2KX14 PWM 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16LC62A-04/SO
Manufacturer Part Number
PIC16LC62A-04/SO
Description
IC MCU OTP 2KX14 PWM 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC62A-04SP.pdf
(337 pages)
Specifications of PIC16LC62A-04/SO
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
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25.13
Note 1: Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.25m/m (0.010”) per
Pin#1
1997 Microchip Technology Inc.
Detail B
Symbol
2
2: Dimension “b” does not include Dambar protrusion, allowable Dambar protrusion shall be 0.08m/m
3: This outline conforms to JEDEC MS-026.
A1
A2
D1
E1
b1
c1
D
N
A
E
L
e
b
c
44-Lead Plastic Surface Mount (TQFP 10x10 mm Body 1.0/0.10 mm Lead Form) (TQ)
side. D1 and E1 dimensions including mold mismatch.
(0.003”)max.
Option 1 (TOP side)
e
1.0ø (0.039ø) Ref.
Detail A
11.75
11.75
1.00
0.05
0.95
9.90
9.90
0.45
0.30
0.30
0.09
0.09
Min
D
44
0
0.80 BSC
1.00 Ref.
L
Millimeters
A2
12.25
10.10
12.25
10.10
Max
1.20
0.15
1.05
0.75
0.45
0.40
0.20
0.16
44
7
A1
Package Group: Plastic TQFP
E
A
E1
Pin#1
Base Metal
Notes
2
c
Detail A
b1
b
3.0ø (0.118ø) Ref.
Option 2 (TOP side)
0.039
0.002
0.037
0.463
0.390
0.463
0.390
0.018
0.012
0.012
0.004
0.004
Lead Finish
Min
D1
44
0
0.031 BSC
c1
Gage Plane
Inches
0.047
0.006
0.041
0.482
0.398
0.482
0.398
0.030
0.018
0.016
0.008
0.006
Max
44
7
PIC16C6X
R 0.08/0.20
0 Min
0.250
11 /13 (4x)
R1 0.08 Min
DS30234D-page 303
11 /13 (4x)
1.00 Ref
Detail B
L
Detail B
L1
Notes
0.20
Min
S
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