PIC18F4455-I/PT Microchip Technology, PIC18F4455-I/PT Datasheet - Page 407

IC PIC MCU FLASH 12KX16 44TQFP

PIC18F4455-I/PT

Manufacturer Part Number
PIC18F4455-I/PT
Description
IC PIC MCU FLASH 12KX16 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4455-I/PT

Program Memory Type
FLASH
Program Memory Size
24KB (12K x 16)
Package / Case
44-TQFP, 44-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
24 KB
Interface Type
SPI, I2C, EAUSART
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
35
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163025
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Package
44TQFP
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPI3-DB18F4550 - BOARD DAUGHTER ICEPIC3DM163025 - PIC DEM FULL SPEED USB DEMO BRDAC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F4455-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F4455-I/PT
Manufacturer:
MICROCH
Quantity:
20 000
40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)
© 2006 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
E1
B1
eB
A1
D
p
A
E
L
B
A
n
c
A1
PIC18F2455/2550/4455/4550
MIN
2.045
Preliminary
.160
.140
.015
.595
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
40
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
10
10
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
15.75
13.46
51.94
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
NOM
40
15.24
13.84
52.26
16.51
2.54
4.45
3.30
0.29
1.27
0.46
3.81
10
10
p
DS39632C-page 405
MAX
A2
15.88
14.22
52.45
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15

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