PIC24HJ64GP506A-I/PT Microchip Technology, PIC24HJ64GP506A-I/PT Datasheet - Page 292
![IC PIC MCU FLASH 64KB 64-TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
PIC24HJ64GP506A-I/PT
Manufacturer Part Number
PIC24HJ64GP506A-I/PT
Description
IC PIC MCU FLASH 64KB 64-TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ64GP206A-IMR.pdf
(304 pages)
3.PIC24HJ64GP206A-IMR.pdf
(10 pages)
Specifications of PIC24HJ64GP506A-I/PT
Core Size
16-Bit
Program Memory Size
64KB (22K x 24)
Core Processor
PIC
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC24
No. Of I/o's
53
Ram Memory Size
8KB
Cpu Speed
40MHz
No. Of Timers
9
Interface
CAN, I2C, SPI, UART
Embedded Interface Type
CAN, I2C, SPI, UART
Rohs Compliant
Yes
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8192 B
Interface Type
SPI, I2C, UART
Maximum Clock Frequency
7.37 MHz
Number Of Timers
13
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ64GP506A-I/PT
Manufacturer:
Microchip
Quantity:
252
Company:
Part Number:
PIC24HJ64GP506A-I/PT
Manufacturer:
MICROCHIP
Quantity:
717
Company:
Part Number:
PIC24HJ64GP506A-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ64GP206A-IMR PDF datasheet #2
- PIC24HJ64GP206A-IMR PDF datasheet #3
- Current page: 292 of 304
- Download datasheet (3Mb)
PIC24HJXXXGPX06A/X08A/X10A
DS70592B-page 292
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
e
b
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
Preliminary
NOTE 2
E1
φ
L
Units
A2
A1
E1
D1
L1
N
A
E
D
e
L
φ
b
α
β
c
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
A2
α
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