PIC18LF2331-I/SP Microchip Technology, PIC18LF2331-I/SP Datasheet - Page 12
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PIC18LF2331-I/SP
Manufacturer Part Number
PIC18LF2331-I/SP
Description
IC MCU FLASH 4KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC18F2331-ISO.pdf
(392 pages)
4.PIC18F2331-ISO.pdf
(8 pages)
5.PIC18F2331-ISO.pdf
(6 pages)
6.PIC18F2331-ISO.pdf
(16 pages)
7.PIC18LF2331-ISO.pdf
(4 pages)
8.PIC18LF2331-ISO.pdf
(40 pages)
Specifications of PIC18LF2331-I/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PIC18F2331/2431/4331/4431
28-Lead Plastic Quad Flat No Lead Package (MM) 6x6x0.9 mm Body (QFN-S) –
With 0.40 mm Contact Length (Saw Singulated)
DS80239A-page 12
• 28-pin QFN packaging details have been added
to Section 27.2 “Package Details” (page 374).
Number of Pins
Pitch
Overall Height
Standoff
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Lead Width
Lead Length
Drawing No. C04-124
A1
*Controlling Parameter
Notes:
JEDEC equivalent: MO-220
TOP VIEW
Dimension Limits
E
Units
E2
D2
A1
E
D
n
e
A
b
L
OPTIONAL
INDEX
AREA
MIN
D
.031
.000
.232
.169
.232
.169
.013
.012
EXPOSED
METAL
INDICATORS
A
ALTERNATE
INCHES
.026 BSC
PAD
NOM
D2
28
INDEX
.035
.001
.236
.175
.236
.175
.015
.016
2
1
MAX
n
.039
.002
.240
.177
.240
.177
.017
.020
BOTTOM VIEW
E2
MIN
0.80
0.00
5.90
4.30
5.90
4.30
0.33
0.30
MILLIMETERS*
© 2005 Microchip Technology Inc.
0.65 BSC
NOM
28
Revised 05/24/04
L
0.90
0.02
6.00
4.45
6.00
4.45
0.38
0.40
b
e
MAX
1.00
0.05
6.10
4.50
6.10
4.50
0.43
0.50