PIC16F76-I/SP Microchip Technology, PIC16F76-I/SP Datasheet - Page 436
![IC MCU FLASH 8KX14 A/D 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F76-I/SP
Manufacturer Part Number
PIC16F76-I/SP
Description
IC MCU FLASH 8KX14 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F76-I/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
10 000
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
53
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F73-ISP PDF datasheet #4
- PIC16F73-ISP PDF datasheet #5
- PIC16F73-ISP PDF datasheet #6
- Current page: 436 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
23.8
23.9
DS31023A-page 23-14
Operation During Sleep
Effects of a Reset
The A/D module can operate during SLEEP mode. This requires that the A/D clock source be set
to RC (ADCS1:ADCS0 = 11). When the RC clock source is selected, the A/D module waits one
instruction cycle before starting the conversion. This allows the SLEEP instruction to be executed,
which eliminates all internal digital switching noise from the conversion. When the conversion is
completed the GO/DONE bit will be cleared, and the result is loaded into the ADRES register. If
the A/D interrupt is enabled, the device will wake-up from SLEEP. If the A/D interrupt is not
enabled, the A/D module will then be turned off, although the ADON bit will remain set.
When the A/D clock source is another clock option (not RC), a SLEEP instruction will cause the
present conversion to be aborted and the A/D module to be turned off (to conserve power),
though the ADON bit will remain set.
Turning off the A/D places the A/D module in its lowest current consumption state.
A device reset forces all registers to their reset state. This forces the A/D module to be turned off,
and any conversion is aborted.
The value that is in the ADRESH:ADRESL registers is not modified for a Power-on Reset. The
ADRESH:ADRESL registers will contain unknown data after a Power-on Reset.
Note:
For the A/D module to operate in SLEEP, the A/D clock source must be set to RC
(ADCS1:ADCS0 = 11). To allow the conversion to occur during SLEEP, ensure the
SLEEP instruction immediately follows the instruction that sets the GO/DONE bit.
Preliminary
1997 Microchip Technology Inc.
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