PIC16F76-I/SO Microchip Technology, PIC16F76-I/SO Datasheet - Page 162

• Manufacturer Part Number: PIC16F76-I/SO
• Description: IC MCU FLASH 8KX14 A/D 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F76-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 14KB (8K x 14)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: I2C/SPI/USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 8-bit
• Data Rom Size: 368 B
• Height: 2.31 mm
• Length: 17.87 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4 V
• Width: 7.49 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F7X
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS30325B-page 160
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
c
CH2 x 45
#leads=n1
Dimension Limits
n
E2
E1
1
E
2
CH1 x 45
Units
CH1
CH2
A2
A3
D1
E2
D2
A1
E1
B1
n1
E
D
B
n
p
A
c
D1
A2
MIN
.165
.145
.020
.024
.040
.000
.685
.685
.650
.650
.590
.590
.008
.026
.013
D
0
0
INCHES*
35
NOM
.050
.173
.153
.028
.029
.045
.005
.690
.690
.653
.653
.620
.620
.029
.020
.011
44
A
11
5
5
MAX
A3
.180
.160
.035
.034
.050
.010
.695
.695
.656
.656
.630
.630
.013
.032
.021
10
10
MIN
17.40
17.40
14.99
14.99
16.51
16.51
B1
4.19
3.68
1.02
0.00
0.20
0.66
0.33
D2
B
0.51
0.61
0
0
MILLIMETERS
p
NOM
2002 Microchip Technology Inc.
17.53
17.53
16.59
16.59
15.75
15.75
1.27
4.39
3.87
0.74
1.14
0.13
0.27
0.74
0.71
0.51
44
11
5
5
A1
MAX
17.65
17.65
16.66
16.66
16.00
16.00
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.53
0.81
10
10