PIC16C55-HSI/SO Microchip Technology, PIC16C55-HSI/SO Datasheet - Page 183

• Manufacturer Part Number: PIC16C55-HSI/SO
• Description: IC MCU OTP 512X12 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C55-HSI/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 20
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• Ram Size: 24 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164002 - MODULE SKT PROMATEII 18/28SOIC
• Lead Free Status / RoHS Status: Request inventory verification / Request inventory verification
• Eeprom Size: -
• Data Converters: -
• Connectivity: -

28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Diameter
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-013
W
n
E1
eB
E
Dimension Limits
§
2
1
Units
A2
eB
A1
E1
B1
c
W
A
E
D
B
n
p
L
c
D
A1
A
MIN
1.430
Preliminary
.195
.155
.015
.595
.514
.125
.008
.050
.016
.610
.270
INCHES*
NOM
1.460
.100
.210
.160
.038
.600
.520
.138
.010
.058
.020
.660
.280
28
MAX
1.490
.225
.165
.060
.625
.526
.150
.012
.065
.023
.710
.290
B
B1
MIN
13.06
36.32
15.49
15.11
4.95
3.94
0.38
3.18
0.20
1.27
6.86
0.41
MILLIMETERS
NOM
15.24
37.08
16.76
13.21
PIC16C5X
2.54
5.33
4.06
0.95
3.49
0.25
1.46
p
0.51
7.11
28
A2
DS30453D-page 181
MAX
15.88
13.36
37.85
18.03
L
5.72
4.19
1.52
0.30
1.65
0.58
7.37
3.81