PIC16F737-I/SS Microchip Technology, PIC16F737-I/SS Datasheet - Page 257

• Manufacturer Part Number: PIC16F737-I/SS
• Description: IC PIC MCU FLASH 4KX14 28SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F737-I/SS

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Type: FLASH
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP
• Controller Family/series: PIC16F
• No. Of I/o's: 25
• Ram Memory Size: 368Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Interface: I2C, SPI, USART
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3DBF777 - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

28-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
JEDEC Equivalent: MO-150
Drawing No. C04-073
B
*Controlling Parameter
Notes:
c
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
p
n
Dimension Limits
E1
E
Units
A2
E1
A1
p
E
D
L
B
n
A
c
f
2
1
f
MIN
.065
.002
.295
.390
.022
.004
.009
.009
L
D
0°
-
INCHES
A1
NOM
28
.026
.307
.402
.030
.069
.209
4°
A
-
-
-
-
MAX
.079
.073
.323
.220
.413
.037
.010
.015
8°
-
MIN
1.65
0.05
7.49
5.00
9.90
0.55
0.09
0.22
0°
-
MILLIMETERS*
PIC16F7X7
NOM
28
10.20
0.65
1.75
7.80
5.30
0.75
4°
-
-
-
-
DS30498C-page 255
A2
MAX
10.50
8.20
5.60
0.95
0.25
0.38
1.85
2.0
8°
-