PIC16C65B-04/P Microchip Technology, PIC16C65B-04/P Datasheet - Page 163
![IC MCU OTP 4KX14 PWM 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16C65B-04/P
Manufacturer Part Number
PIC16C65B-04/P
Description
IC MCU OTP 4KX14 PWM 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F818-ISO.pdf
(6 pages)
2.PIC16C63A-04SP.pdf
(184 pages)
3.PIC16C63A-04SP.pdf
(10 pages)
4.PIC16C63A-04SP.pdf
(10 pages)
5.PIC16C65B-04P.pdf
(7 pages)
Specifications of PIC16C65B-04/P
Program Memory Type
OTP
Program Memory Size
7KB (4K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16C65B-04/P
Manufacturer:
MICROCHIP
Quantity:
1 450
Part Number:
PIC16C65B-04/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
PIC16C65B-04/PQ
Manufacturer:
IXYS
Quantity:
2 349
Company:
Part Number:
PIC16C65B-04/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
PIC16C65B-04/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
18.10 44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
2000 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
c
CH2 x 45
#leads=n1
Dimension Limits
n
E2
E1
1
E
2
CH1 x 45
CH2
Units
CH1
D2
A2
A3
D1
E2
n1
A1
E1
B1
A
E
D
B
n
p
c
D1
A2
MIN
.165
.145
.020
.024
.040
.000
.685
.685
.650
.650
.590
.590
.008
.026
.013
D
PIC16C63A/65B/73B/74B
0
0
INCHES*
NOM
35
.050
.173
.153
.028
.029
.045
.005
.690
.690
.653
.653
.620
.620
.029
.020
.011
44
A
11
5
5
MAX
A3
.180
.160
.035
.034
.050
.010
.695
.695
.656
.656
.630
.630
.013
.032
.021
10
10
MIN
17.40
17.40
14.99
14.99
16.51
16.51
B1
4.19
3.68
1.02
0.00
0.20
0.66
0.33
D2
B
0.51
0.61
0
0
MILLIMETERS
p
NOM
17.53
17.53
16.59
16.59
15.75
15.75
1.27
4.39
3.87
0.74
1.14
0.13
0.27
0.74
0.71
0.51
44
11
5
5
A1
DS30605C-page 163
MAX
17.65
17.65
16.66
16.66
16.00
16.00
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.53
0.81
10
10