PIC24FJ64GA104-I/ML Microchip Technology, PIC24FJ64GA104-I/ML Datasheet - Page 3

• Manufacturer Part Number: PIC24FJ64GA104-I/ML
• Description: IC PIC MCU FLASH 64KB 44-QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24FJ64GA104-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 44-QFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 35
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/IrDA/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM240001, MA240020, DM240002, DM240011, DV164033
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 13-ch x 10-bit
• Controller Family/series: PIC24
• Ram Memory Size: 8KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Embedded Interface Type: I2C, LIN, SPI, USART
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Preface ........................................................................................................................... 5
Chapter 1. Introduction to the XLP 16-Bit Board
Chapter 2. The XLP Demonstration Application
Chapter 3. XLP 16-Bit Development Board Hardware
Appendix A. Development Kit Schematics ............................................................... 29
Index ............................................................................................................................. 35
Worldwide Sales and Service .................................................................................... 36
 2010 Microchip Technology Inc.
1.1 Introduction ................................................................................................... 11
1.2 Highlights ...................................................................................................... 11
1.3 What’s in the Kit ........................................................................................... 12
1.4 Development Board Features ...................................................................... 12
1.5 Using the Development Board Out of the Box ............................................. 13
1.6 Demonstration Program ............................................................................... 14
1.7 Reference Documents .................................................................................. 14
2.1 Initial Setup ................................................................................................... 15
2.2 Demonstration Program Operation .............................................................. 17
3.1 Introduction ................................................................................................... 21
3.2 Hardware Features ....................................................................................... 21
3.3 Current Measurement .................................................................................. 27
Table of Contents
XLP 16-BIT DEVELOPMENT KIT
USER’S GUIDE
DS51873B-page 3