PIC16LF871-I/P Microchip Technology, PIC16LF871-I/P Datasheet - Page 91

• Manufacturer Part Number: PIC16LF871-I/P
• Description: IC PIC MCU FLASH 2KX14 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16LF871-I/P

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Oscillator Type: External
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Type: FLASH
• Eeprom Size: 64 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16LF
• No. Of I/o's: 33
• Eeprom Memory Size: 64Byte
• Ram Memory Size: 128Byte
• Cpu Speed: 20MHz
• No.: RoHS Compliant
• Processor Series: PIC16LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: PSP, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 33
• Number Of Timers: 8
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 28 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11.2
11.2.1
The PIC16F870/871 can be operated in four different
Oscillator modes. The user can program two configura-
tion bits (FOSC1 and FOSC0) to select one of these
four modes:
• LP
• XT
• HS
• RC
11.2.2
In XT, LP or HS modes, a crystal or ceramic resonator
is connected to the OSC1/CLKI and OSC2/CLKO pins
to establish oscillation (Figure 11-1). The PIC16F870/
871 oscillator design requires the use of a parallel cut
crystal. Use of a series cut crystal may give a frequency
out of the crystal manufacturers specifications. When in
XT, LP or HS modes, the device can have an external
clock source to drive the OSC1/CLKI pin (Figure 11-2).
FIGURE 11-1:
 2003 Microchip Technology Inc.
Note 1:
C1
C2
2:
3:
Oscillator Configurations
(1)
(1)
Low Power Crystal
Crystal/Resonator
High Speed Crystal/Resonator
Resistor/Capacitor
CRYSTAL OSCILLATOR/CERAMIC
RESONATORS
OSCILLATOR TYPES
See Table 11-1 and Table 11-2 for
recommended values of C1 and C2.
A series resistor (R
AT strip cut crystals.
RF varies with the crystal chosen.
XTAL
R
s
(2)
OSC1
OSC2
CRYSTAL/CERAMIC
RESONATOR OPERATION
(HS, XT OR LP
OSC CONFIGURATION)
s
RF
) may be required for
(3)
PIC16F870/871
SLEEP
To
Internal
Logic
FIGURE 11-2:
TABLE 11-1:
All resonators used did not have built-in capacitors.
16.0 MHz
These values are for design guidance only.
See notes following Table 11-2.
455 kHz
2.0 MHz
4.0 MHz
8.0 MHz
Clock from
Ext. System
Mode
HS
XT
Panasonic EFO-A455K04B
Murata Erie CSA16.00MX
16.0 MHz
Murata Erie CSA2.00MG
Murata Erie CSA4.00MG
Murata Erie CSA8.00MT
Open
455 kHz
2.0 MHz
4.0 MHz
8.0 MHz
PIC16F870/871
Freq.
Resonators Used:
CERAMIC RESONATORS
Ranges Tested:
EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR LP
OSC CONFIGURATION)
68 - 100 pF
OSC1
OSC2
15 - 68 pF
15 - 68 pF
10 - 68 pF
10 - 22 pF
OSC1
PIC16F870/871
DS30569B-page 89
68 - 100 pF
15 - 68 pF
15 - 68 pF
10 - 68 pF
10 - 22 pF
OSC2
0.3%
0.5%
0.5%
0.5%
0.5%