PIC16F88-I/SS Microchip Technology, PIC16F88-I/SS Datasheet - Page 148
![IC MCU FLASH 4KX14 EEPROM 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16F88-I/SS
Manufacturer Part Number
PIC16F88-I/SS
Description
IC MCU FLASH 4KX14 EEPROM 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F87-IP.pdf
(228 pages)
5.PIC16F87-IP.pdf
(8 pages)
6.PIC16F87-IP.pdf
(4 pages)
7.PIC16F87-IP.pdf
(8 pages)
8.PIC16F88-ISO.pdf
(214 pages)
Specifications of PIC16F88-I/SS
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
SSP/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
7-ch x 10-bit
Data Rom Size
256 B
A/d Bit Size
10 bit
A/d Channels Available
7
Height
1.75 mm
Length
7.2 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
5.3 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC164307 - MODULE SKT FOR PM3 28SSOPAC164018 - MODULE SKT PROMATEII 20SSOP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F88-I/SS
Manufacturer:
U-BLOX
Quantity:
12 000
PIC16F87/88
15.13.1
The device can wake-up from SLEEP through one of
the following events:
1.
2.
3.
External MCLR Reset will cause a device RESET. All
other events are considered a continuation of program
execution and cause a “wake-up”. The TO and PD bits
in the STATUS register can be used to determine the
cause of the device RESET. The PD bit, which is set on
power-up, is cleared when SLEEP is invoked. The TO
bit is cleared if a WDT time-out occurred and caused
wake-up.
The following peripheral interrupts can wake the device
from SLEEP:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Other peripherals cannot generate interrupts, since
during SLEEP, no on-chip clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is pre-fetched. For the device to
wake-up through an interrupt event, the corresponding
FIGURE 15-12:
DS30487B-page 146
Note
OSC1
CLKO
INT pin
INTF Flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
Instruction
Fetched
Instruction
Executed
External RESET input on MCLR pin.
Watchdog Timer wake-up (if WDT was enabled).
Interrupt from INT pin, RB port change or a
peripheral interrupt.
TMR1 interrupt. Timer1 must be operating as an
asynchronous counter.
CCP Capture mode interrupt.
Special event trigger (Timer1 in Asynchronous
mode using an external clock).
SSP (START/STOP) bit detect interrupt.
SSP transmit or receive in Slave mode (SPI/I
A/D conversion (when A/D clock source is RC).
EEPROM write operation completion.
Comparator output changes state.
USART RX or TX (Synchronous Slave mode).
(4)
(3)
1:
2:
3:
4:
PC
WAKE-UP FROM SLEEP
XT, HS or LP Oscillator mode assumed.
T
GIE = 1 assumed. In this case, after wake-up, the processor jumps to the interrupt routine.
If GIE = 0, execution will continue in-line.
CLKO is not available in these Osc modes, but shown here for timing reference.
OST
Inst(PC) = SLEEP
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
Inst(PC - 1)
= 1024 T
PC
WAKE-UP FROM SLEEP THROUGH INTERRUPT
OSC
(drawing not to scale). This delay will not be there for RC Osc mode.
Inst(PC + 1)
SLEEP
PC+1
Processor in
SLEEP
2
PC+2
C).
Preliminary
T
OST
(2)
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Inst(PC + 2)
Inst(PC + 1)
interrupt enable bit must be set (enabled). Wake-up
occurs regardless of the state of the GIE bit. If the GIE
bit is clear (disabled), the device continues execution at
the instruction after the SLEEP instruction. If the GIE bit
is set (enabled), the device executes the instruction
after the SLEEP instruction and then branches to the
interrupt address (0004h). In cases where the execu-
tion of the instruction following SLEEP is not desirable,
the user should have a NOP after the SLEEP instruction.
15.13.2
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
• If the interrupt occurs during or after the
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruction
should be executed before a SLEEP instruction.
PC+2
SLEEP instruction, the SLEEP instruction will com-
plete as a NOP. Therefore, the WDT and WDT
prescaler and postscaler (if enabled) will not be
cleared, the TO bit will not be set and the PD bit
will not be cleared.
execution of a SLEEP instruction, the device will
immediately wake-up from SLEEP. The SLEEP
instruction will be completely executed before the
wake-up. Therefore, the WDT and WDT prescaler
and postscaler (if enabled) will be cleared, the TO
bit will be set and the PD bit will be cleared.
Interrupt Latency
Dummy Cycle
WAKE-UP USING INTERRUPTS
(Note 2)
PC + 2
(1)
2003 Microchip Technology Inc.
Dummy Cycle
Inst(0004h)
0004h
Inst(0005h)
Inst(0004h)
0005h