PIC18F2450-I/SP Microchip Technology, PIC18F2450-I/SP Datasheet - Page 15
![IC PIC MCU FLASH 8KX16 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F2450-I/SP
Manufacturer Part Number
PIC18F2450-I/SP
Description
IC PIC MCU FLASH 8KX16 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F2450-ISO.pdf
(324 pages)
3.PIC18F2450-ISO.pdf
(6 pages)
4.PIC18F2450-ISO.pdf
(8 pages)
5.PIC18F2450-ISO.pdf
(4 pages)
6.PIC18F2450-ISO.pdf
(4 pages)
7.PIC18F4450-IP.pdf
(322 pages)
Specifications of PIC18F2450-I/SP
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
23
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART/USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
23
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163025 - PIC DEM FULL SPEED USB DEMO BRD
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
3.1.2
When using low-voltage ICSP, the part must be
supplied by the voltage specified in Parameter D111 if
a Bulk Erase is to be executed. All other Bulk Erase
details, as described above, apply.
If it is determined that a program memory erase must
be performed at a supply voltage below the Bulk Erase
limit, refer to the erase methodology described in
Section 3.1.3 “ICSP Row Erase”
“Modifying Code
FIGURE 3-2:
3.1.3
Regardless of whether high or low-voltage ICSP is used,
it is possible to erase one row (64 bytes of data), provided
the block is not code or write-protected. Rows are located
at static boundaries, beginning at program memory
address, 000000h, extending to the internal program
memory limit (see
The Row Erase duration is externally timed and is
controlled by PGC. After the WR bit in EECON1 is set,
a NOP is issued, where the 4th PGC is held high for the
duration of the programming time, P9.
After PGC is brought low, the programming sequence
is terminated. PGC must be held low for the time
specified by Parameter P10 to allow high-voltage
discharge of the memory array.
2010 Microchip Technology Inc.
PGC
PGD
4-Bit Command
1
0
LOW-VOLTAGE ICSP BULK ERASE
ICSP ROW ERASE
2
0
3
1
Section 2.3 “Memory
4
Memory”.
1
P5
BULK ERASE TIMING
1
1
Data Payload
2
1
16-Bit
15 16
0
and
0
P5A
Maps”).
Section 3.2.1
4-Bit Command
1
0
2
0
PIC18F2XXX/4XXX FAMILY
3
0
PGD = Input
4
0
P5
1
0
Data Payload
2
0
16-Bit
If it is determined that a data EEPROM erase
(selected devices only, see
EEPROM
supply voltage below the Bulk Erase limit, follow the
methodology
EEPROM Programming”
The code sequence to Row Erase a PIC18F2XXX/
4XXX family device is shown in
flowchart, shown in
necessary to completely erase a PIC18F2XXX/4XXX
family device. The timing diagram that details the Start
Programming command and Parameters P9 and P10
is shown in
15 16
Note:
0
0
P5A
4-Bit Command
Programming”) must be performed at a
1
0
Figure
The TBLPTR register can point to any
byte within the row intended for erase.
2
0
described
3
0
3-5.
4
0
Figure
Erase Time
and write ‘1’s to the array.
in
P11
3-3, depicts the logic
Section 3.3
Section 3.3 “Data
DS39622L-page 15
Table
P10
Data Payload
16-Bit
3-3. The
1
n
2
“Data
n