PIC24FJ32GB002-I/SO Microchip Technology, PIC24FJ32GB002-I/SO Datasheet - Page 46

IC MCU 16BIT 32KB FLASH 28SOIC

PIC24FJ32GB002-I/SO

Manufacturer Part Number
PIC24FJ32GB002-I/SO
Description
IC MCU 16BIT 32KB FLASH 28SOIC
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr

Specifications of PIC24FJ32GB002-I/SO

Program Memory Type
FLASH
Program Memory Size
32KB (11K x 24)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
19
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C/IrDA/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
19
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM240001, MA240019, DM240002, DM240011, DV164033
Minimum Operating Temperature
- 40 C
On-chip Adc
9-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC24FJ64GA1/GB0
7.0
DS39934B-page 46
Standard Operating Conditions
Operating Temperature: 0°C to +70°C. Programming at +25°C is recommended.
D111A V
D111B V
D112
D113
D031
D041
D080
D090
D012
D013
P1
P1A
P1B
P2
P3
P4
P4A
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
Note 1:
Param
No.
2:
I
I
V
V
V
V
C
C
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
Symbol
PP
DDP
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
PGC
PGCL
PGCH
SET
HLD
DLY
DLY
DLY
SET
HLD
DLY
DLY
DLY
DLY
DLY
DLY
R
VALID
DLY
HLD
KEY
KEY
DLY
DLY
DD
DDCORE
IL
IH
OL
OH
IO
F
V
“Power Requirements” for more information.
V
and V
1
1
1
1
2
2
2
3
4
6
7
8
9
10
3
1
2
11
12
DDCORE
DD
A
must also be supplied to the AV
SS
Supply Voltage During Programming
Voltage on V
Programming Current on MCLR
Supply Current During Programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O pin (PGDx)
Filter Capacitor Value on V
Serial Clock (PGCx) Period
Serial Clock (PGCx) Low Time
Serial Clock (PGCx) High Time
Input Data Setup Time to Serial Clock ↑
Input Data Hold Time from PGCx ↑
Delay Between 4-Bit Command and Command
Operand
Delay Between 4-Bit Command Operand and
Next 4-Bit Command
Delay Between Last PGCx ↓ of Command Byte
to First PGCx ↑ of Read of Data Word
V
Input Data Hold Time from MCLR ↑
Delay Between Last PGCx ↓ of Command Byte
to PGDx ↑ by Programming Executive
Programming Executive Command
Processing Time
PGCx Low Time After Programming
Chip Erase Time
Page Erase Time
Row Programming Time
MCLR Rise Time to Enter ICSP™ mode
Data Out Valid from PGCx ↑
Delay Between Last PGCx ↓ and MCLR ↓
MCLR ↓ to V
Delay from First MCLR ↓ to First PGCx ↑ for
Key Sequence on PGDx
Delay from Last PGCx ↓ for Key Sequence on
PGDx to Second MCLR ↑
Delay Between PGDx ↓ by Programming
Executive to PGDx Driven by Host
Delay Between Programming Executive
Command Response Words
DD
, respectively.
must be supplied to the V
↑ Setup Time to MCLR ↑
DDCORE
DD
Characteristic
Pin During Programming
CAP
DDCORE
DD
pins during programming. AV
/V
CAP
pin if the on-chip voltage regulator is disabled. See Section 2.1
V
DDCORE
0.8 V
2.25
Min
V
100
100
400
400
100
3.0
4.7
40
40
15
15
40
40
20
25
12
40
40
10
40
23
2
0
1
8
SS
DD
+ 0.1
DD
and AV
0.2 V
Max
3.60
2.75
V
0.4
1.0
50
10
5
2
DD
DD
SS
should always be within ±0.3V of V
Units
mA
ms
ms
ms
ms
ms
μA
pF
μF
ns
ns
ns
ns
ns
ns
ns
ns
ns
μs
μs
ns
μs
ns
ns
ns
µs
ns
V
V
V
V
V
V
s
© 2009 Microchip Technology Inc.
Normal programming
Normal programming
I
I
To meet AC specifications
Required for controller core
OL
OH
= 8.5 mA @ 3.6V
= -3.0 mA @ 3.6V
Conditions
(1,2)
(1,2)
DD

Related parts for PIC24FJ32GB002-I/SO