PIC16F872-I/SS Microchip Technology, PIC16F872-I/SS Datasheet - Page 636

IC MCU FLASH 2KX14 EE 28SSOP

PIC16F872-I/SS

Manufacturer Part Number
PIC16F872-I/SS
Description
IC MCU FLASH 2KX14 EE 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F872-I/SS

Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
64Byte
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C, SPI, SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3 bit
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164307 - MODULE SKT FOR PM3 28SSOPAC164020 - MODULE SKT PROMATEII 44TQFPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F872-I/SS
Manufacturer:
MICROCHIP
Quantity:
1 400
Part Number:
PIC16F872-I/SS
Manufacturer:
Microchip Technology
Quantity:
1 867
Part Number:
PIC16F872-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
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PICmicro MID-RANGE MCU FAMILY
32.1
DS31032A-page 32-2
Introduction
Microchip offers a wide range of tightly integrated development tools to ease the application
development process. These can be broken down into the core development tools and the sup-
plemental tools.
The core tools are as follows:
• MPLAB Integrated Development Environment, including full featured editor
• Language Products
• MPLAB-SIM Software Simulator
• Real-Time In-Circuit Emulators
• Device Programmers
Supplemental Tools:
• Other Software Programming Tools
• Development Boards
The minimum configuration of MPLAB, is the Integrated Development Environment (IDE), the
assembler (MPASM), and the software simulator (MPLAB-SIM). Other tools are added to MPLAB
as they are installed. This gives a common platform for the design activity, from the writing and
assembling of the source code, through the simulation/emulation, to the programming of proto-
type devices.
In addition to Microchip, there are many third party vendors. Microchip’s Third Party Handbook
gives an overview of the manufactures and their tools.
- MPASM Assembler
- MPLAB-C C Compiler
- PICMASTER/PICMASTER CE Emulator with Full Featured Trace and Breakpoint
- ICEPIC Low-Cost Emulator with Breakpoint debug capabilities
- PRO MATE II Universal Programmer
- PICSTART Plus Entry-Level Prototype Programmer
- fuzzyTECH
- MP-Driveway Application Code Generator
- PICDEM-1 Low-Cost Demonstration Board
- PICDEM-2 Low-Cost Demonstration Board
- PICDEM-3 Low-Cost Demonstration Board
- PICDEM-14A Low-Cost Demonstration Board
Note:
debug capabilities
The most current version may be downloaded from Microchip’s web site or BBS for
free.
MP Fuzzy logic development system
1997 Microchip Technology Inc.

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