PIC16C62B-20/SO Microchip Technology, PIC16C62B-20/SO Datasheet - Page 108
![IC MCU OTP 2KX14 PWM 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16C62B-20/SO
Manufacturer Part Number
PIC16C62B-20/SO
Description
IC MCU OTP 2KX14 PWM 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F818-ISO.pdf
(6 pages)
2.PIC16C62B-04SO.pdf
(120 pages)
3.PIC16C62B-04SO.pdf
(5 pages)
Specifications of PIC16C62B-20/SO
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI
Number Of I /o
22
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC16C
No. Of I/o's
22
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C, SPI, SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
28
Number Of Timers
8
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
0 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16C62B-20/SO
Manufacturer:
MICROCHI
Quantity:
149
Part Number:
PIC16C62B-20/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16C62B/72A
15.4
DS35008B-page 108
28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
B
c
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
p
n
45
E1
E
Dimension Limits
h
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
D
L
MIN
Preliminary
.695
.093
.088
.004
.394
.288
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
28
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
NOM
1999 Microchip Technology Inc.
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
28
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8