PIC18F44J50-I/ML Microchip Technology, PIC18F44J50-I/ML Datasheet - Page 8
![IC PIC MCU FLASH 16K 2V 44-QFN](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC18F44J50-I/ML
Manufacturer Part Number
PIC18F44J50-I/ML
Description
IC PIC MCU FLASH 16K 2V 44-QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18LF24J10-ISS.pdf
(32 pages)
2.PIC18LF24J50-ISS.pdf
(554 pages)
3.PIC18LF24J50-ISS.pdf
(12 pages)
4.PIC18F24J50-ISS.pdf
(18 pages)
5.PIC18F26J11-ISO.pdf
(28 pages)
Specifications of PIC18F44J50-I/ML
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
44-QFN
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
34
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3776 B
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
48 MHz
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136, MA180024
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F46J50 FAMILY
Data Sheet Clarifications
The following typographic corrections and clarifications
are to be noted for the latest version of the Device Data
Sheet (DS39931C):
1. Module: Special Features (CONFIG2L)
2. Module: DC Characteristics
DS80436C-page 8
Note:
The “T1DIG” feature mentioned in the Device
Data Sheet (DS39931C) is not implemented in
this device family. The feature, associated with
bit 3 of the CONFIG2L Configuration register, is
discussed in Section 26.1 “Configuration
Bits” and Section 2.5.1 “Oscillator Control
Register”.
For application firmware to switch to the Timer1
clock source, it must first enable the crystal
driver by setting the T1OSCEN bit (T1CON<3>).
The microcontroller will ignore attempts to clock
switch to the Timer1 clock source when the
crystal driver is disabled.
Section 29.2 “DC Characteristics: Power-
Down and Supply Current” lists the maximum
Power-Down (I
PIC18FXXJ50 devices, operating at V
and -40°C, and 25°C at 5 A.
The correct maximum is 6 A.
Corrections are shown in bold. Where
possible, the original bold text formatting
has been removed for clarity.
(Power-Down Current)
PD
) Sleep mode current for
DD
= 2.15V
3. Module: DC Characteristics (Input
In Table 29-7 USB Module Specifications,
electrical parameter D314 indicates the D+ and
D- pin leakage is +/-0.2 A maximum. The
updated specification is +/-0.5 A maximum,
over the -40°C to +85°C temperature range.
The input leakage specification for all other I/O
pins remains unchanged at the +/-0.2 A maxi-
mum level, as indicated by electrical parameters
D060, D061 and D063 (I
Characteristics”.
Leakage)
2010 Microchip Technology Inc.
IL
), in Section 29.3 “DC