PIC16F639-I/SS Microchip Technology, PIC16F639-I/SS Datasheet - Page 96

IC MCU FLASH 2KX14 20SSOP

PIC16F639-I/SS

Manufacturer Part Number
PIC16F639-I/SS
Description
IC MCU FLASH 2KX14 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F639-I/SS

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS1-1 - SOCKET TRANSITION 20DIP 20SSOPXLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC162066 - HEADER INTRFC MPLAB ICD2 20PINAC164307 - MODULE SKT FOR PM3 28SSOP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC16F630/676
12.7
DS40039C-page 94
DC CHARACTERISTICS
D100
D101
D120
D120A
D121
D122
D123
D124
D130
D130A
D131
D132
D133
D134
Param
Note 1: See Section 8.5.1 for additional information.
No.
DC Characteristics: PIC16F630/676-I (Industrial), PIC16F630/676-E (Extended)
(Cont.)
*
C
C
E
E
V
T
T
T
E
E
V
V
T
T
These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Sym
RETD
REF
RETD
DEW
PEW
D
D
DRW
P
D
PR
PEW
OSC2
IO
Capacitive Loading Specs
on Output Pins
OSC2 pin
All I/O pins
Data EEPROM Memory
Byte Endurance
Byte Endurance
V
Erase/Write cycle time
Characteristic Retention
Number of Total Erase/Write
Cycles before Refresh
Program FLASH Memory
Cell Endurance
Cell Endurance
V
V
Erase/Write cycle time
Characteristic Retention
DD
DD
DD
for Read/Write
for Read
for Erase/Write
Characteristic
(1)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
100K
V
V
Min
10K
10K
1M
4.5
1K
40
40
MIN
MIN
Typ†
100K
100K
10M
10K
1M
5
2
Max
15*
50*
5.5
5.5
5.5
2.5
6
-40°C ≤ T
Units
Year Provided no other specifications
Year Provided no other specifications
E/W -40°C ≤ T
E/W +85°C ≤ T
E/W -40°C ≤ T
E/W -40°C ≤ T
E/W +85°C ≤ T
ms
ms
pF
pF
V
V
V
A
A
In XT, HS and LP modes when
external clock is used to drive
OSC1
Using EECON to read/write
V
voltage
are violated
V
voltage
are violated
≤ +85°C for industrial
≤ +125°C for extended
 2003 Microchip Technology Inc.
MIN
MIN
= Minimum operating
= Minimum operating
A
A
A
Conditions
A
A
≤ +85°C
≤ +85°C
≤ +85°C
≤ +125°C
≤ +125°C

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