PIC16F639-I/SS Microchip Technology, PIC16F639-I/SS Datasheet - Page 182

• Manufacturer Part Number: PIC16F639-I/SS
• Description: IC MCU FLASH 2KX14 20SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F639-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 20-SSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, LVD, POR, WDT
• Number Of I /o: 11
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT20SS1-1 - SOCKET TRANSITION 20DIP 20SSOPXLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC162066 - HEADER INTRFC MPLAB ICD2 20PINAC164307 - MODULE SKT FOR PM3 28SSOP
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F635/PIC16F636/639
TABLE 15-2:
DS41232D-page 180
Standard Operating Conditions (unless otherwise stated)
Operating Temperature
OS06
OS07
OS08
OS09*
OS10*
Note 1:
Param
No.
2:
3:
*
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
T
T
HF
LF
T
These parameters are characterized but not tested.
and are not tested.
Instruction cycle period (T
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock)
for all devices.
To ensure these oscillator frequency tolerances, V
device as possible. 0.1 F and 0.01 F values in parallel are recommended.
By design.
SC
WARM
IOSCST
Sym
OSC
OSC
OSCILLATOR PARAMETERS
Internal Oscillator Switch
when running
Fail-Safe Sample Clock
Period
Internal Calibrated
HFINTOSC Frequency
Internal Uncalibrated
LFINTOSC Frequency
HFINTOSC Oscillator
Wake-up from Sleep
Start-up Time
Characteristic
(1)
-40°C
(3)
T
CY
A
) equals four times the input oscillator time base period. All specified values are
+125°C
(2)
Tolerance
Freq
—
—
1%
2%
5%
—
—
—
—
DD
7.92
7.84
7.60
Min
5.5
3.5
15
—
—
3
and V
Typ†
SS
8.0
8.0
8.0
—
21
31
12
7
6
must be capacitively decoupled as close to the
Max
8.08
8.16
8.40
45
24
14
—
11
2
Units
T
MHz
MHz
MHz
kHz
ms
OSC
s
s
s
© 2007 Microchip Technology Inc.
Slowest clock
LFINTOSC/64
V
2.5V
0°C
2.0V
-40°C
-40°C
V
V
V
DD
DD
DD
DD
= 3.5V, 25°C
= 2.0V, -40°C to +85°C
= 3.0V, -40°C to +85°C
= 5.0V, -40°C to +85°C
T
V
V
A
Conditions
T
T
DD
DD
A
A
+85°C
+85°C (Ind.),
+125°C (Ext.)
5.5V,
5.5V,