PIC18F26K20-E/SP Microchip Technology, PIC18F26K20-E/SP Datasheet - Page 27
![IC PIC MCU FLASH 32KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F26K20-E/SP
Manufacturer Part Number
PIC18F26K20-E/SP
Description
IC PIC MCU FLASH 32KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(456 pages)
3.PIC18F26K20-ISS.pdf
(6 pages)
4.PIC18F26K20-ISS.pdf
(10 pages)
5.PIC18F26K20-ISO.pdf
(430 pages)
Specifications of PIC18F26K20-E/SP
Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
CCP, ECCP, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
64 MHz
Operating Supply Voltage
2.5|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
FIGURE 4-4:
FIGURE 4-5:
4.5
A data EEPROM address may be read via a sequence
of core instructions (4-bit command, ‘0000’) and then
output on PGD via the 4-bit command, ‘0010’ (TABLAT
register). The result may then be immediately
compared to the appropriate data in the programmer’s
memory for verification. Refer to Section 4.4 “Read
Data EEPROM Memory” for implementation details of
reading data EEPROM.
© 2009 Microchip Technology Inc.
PGC
PGD
Note 1:
PGC
PGD
Verify Data EEPROM
1
0
2
1
Magnification of the High-Impedance delay between PGC and PGD is shown in Figure 4-5.
MSb
3
0
4
0
SHIFT OUT DATA HOLDING REGISTER TIMING DIAGRAM (0010)
HIGH-IMPEDANCE DELAY
P5
PGD = Input
1
1
n
P19
2
P3
3
2
4
n
5
Advance Information
6
7
8
P6
LSb
9
P14
4.6
The term “Blank Check” means to verify that the device
has no programmed memory cells. All memories must
be verified: code memory, data EEPROM, ID locations
and Configuration bits. The device ID registers
(3FFFFEh:3FFFFFh) should be ignored.
A “blank” or “erased” memory cell will read as a ‘1’.
Therefore, Blank Checking a device merely means to
verify that all bytes read as FFh except the Configura-
tion bits. Unused (reserved) Configuration bits will read
‘0’ (programmed). Refer to Table 5-1 for blank configu-
ration expect data for the various PIC18F2XK20/
4XK20 devices.
Given that Blank Checking is merely code and data
EEPROM verification with FFh expect data, refer to
Section 4.4 “Read Data EEPROM Memory” and
Section 4.2 “Verify Code Memory and ID Locations”
for implementation details.
FIGURE 4-6:
PIC18F2XK20/4XK20
10 11
1
2
PGD = Output
12
Shift Data Out
Blank Check
3
Blank Check Device
13
4
14
device
Abort
blank?
5
Start
Is
15 16
No
6
BLANK CHECK FLOW
MSb
P5A
(Note 1)
(Note 1)
Fetch Next 4-bit Command
Yes
1
n
PGD = Input
2
n
DS41297F-page 27
3
Continue
n
4
n