PIC16CE623-20/P Microchip Technology, PIC16CE623-20/P Datasheet - Page 97

• Manufacturer Part Number: PIC16CE623-20/P
• Description: IC MCU OTP 512X14 EE COMP 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16CE623-20/P

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: OTP
• Eeprom Size: 128 x 8
• Ram Size: 96 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-DIP (0.300", 7.62mm)
• For Use With: 309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Data Converters: -
• Connectivity: -

14.0
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
1999 Microchip Technology Inc.
PACKAGING INFORMATION
JEDEC Equivalent: MO-036
Drawing No. C04-010
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Width
Window Length
*Controlling Parameter
W2
n
E1
W1
eB
E
Dimension Limits
2
1
Units
W2
W1
D
A2
E1
B1
eB
A1
D
A
E
L
B
n
p
c
c
A1
A
MIN
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
INCHES*
NOM
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
18
B
B1
MAX
.195
.165
.030
.325
.295
.920
.150
.012
.060
.425
.150
.210
.021
MIN
22.35
4.32
3.94
0.38
7.62
7.24
3.18
0.20
1.27
8.76
3.30
4.83
0.41
MILLIMETERS
p
PIC16CE62X
NOM
22.86
A2
2.54
4.64
4.06
0.57
7.94
7.37
3.49
0.25
1.40
0.47
9.78
3.56
5.08
18
L
MAX
DS40182C-page 97
23.37
10.80
4.95
4.19
0.76
8.26
7.49
0.30
1.52
0.53
5.33
3.81
3.81