PIC16F72-I/SP Microchip Technology, PIC16F72-I/SP Datasheet - Page 124

• Manufacturer Part Number: PIC16F72-I/SP
• Description: IC PIC MCU FLASH 2KX14 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F72-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C, SPI, SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 5 Channel
• Data Rom Size: 8 B
• Height: 3.3 mm
• Length: 34.67 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 7.24 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F72
28-Lead Plastic Quad Flat No Leads Package (ML) 6x6 mm Body (QFN) (Continued)
DS39597B-page 122
Pitch
Pad Width
Pad Length
Pad to Solder Mask
*Controlling Parameter
Drawing No. C04-2114
SOLDER
MASK
M
Dimension Limits
M
Units
M
p
B
L
MIN
.009
.020
.005
INCHES
.026 BSC
NOM
B
.011
.024
MAX
.014
.030
.006
MIN
0.23
0.50
0.13
MILLIMETERS*
2002 Microchip Technology Inc.
0.65 BSC
NOM
0.28
0.60
PACKAGE
EDGE
L
p
MAX
0.35
0.75
0.15