PIC12C672-10I/P Microchip Technology, PIC12C672-10I/P Datasheet - Page 93

• Manufacturer Part Number: PIC12C672-10I/P
• Description: IC MCU OTP 2KX14 A/D 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12C672-10I/P

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Core Processor: PIC
• Speed: 10MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Type: OTP
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Ram Memory Size: 128Byte
• Cpu Speed: 10MHz
• No. Of Timers: 1
• Digital Ic Case Style: DIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMINGAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

DC CHARACTERISTICS
Note 1: Data in Typical ("Typ") column is based on characterization results at 25°C. This data is for design guidance only and is not
Parm
1999 Microchip Technology Inc.
No.
*
2: This is the limit to which V
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator
4: For EXTRC osc configuration, current through R
5: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the
6: INTRC calibration value is for 4MHz nominal at 5V, 25°C.
LP Oscillator Operating
Frequency
INTRC/EXTRC Oscillator
Operating Frequency
XT Oscillator Operating
Frequency
HS Oscillator Operating
Frequency
These parameters are characterized but not tested.
tested.
type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption.
a) The test conditions for all I
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
formula:
Ir = V
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to V
MCLR = V
DD
Characteristic
/2R
EXT
DD
(mA) with R
; WDT disabled.
DD
EXT
can be lowered in SLEEP mode without losing RAM data.
DD
in kOhm.
measurements in active operation mode are:
F
Sym
OSC
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
Min Typ
—
0
0
0
EXT
is not included. The current through the resistor can be estimated by the
(1)
Max Units
200
4
10
4
(6)
MHz
MHz
MHz
kHz
–40°C
–40°C
DD
0°C
or V
All temperatures
All temperatures
All temperatures
All temperatures
SS
T
T
SS
.
T
A
A
A
, T0CKI = V
+85°C (industrial)
+125°C (extended)
+70°C (commercial)
PIC12C67X
Conditions
DD
,
DS30561B-page 93