PIC16F818-I/SO Microchip Technology, PIC16F818-I/SO Datasheet - Page 32
![IC MCU FLASH 1KX14 18-SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16F818-I/SO
Manufacturer Part Number
PIC16F818-I/SO
Description
IC MCU FLASH 1KX14 18-SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(176 pages)
4.PIC16F818-ISO.pdf
(6 pages)
5.PIC16F818-ISO.pdf
(8 pages)
6.PIC16F818-ISO.pdf
(8 pages)
Specifications of PIC16F818-I/SO
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F818-I/SO
Manufacturer:
MICROCHIP
Quantity:
3 290
Part Number:
PIC16F818-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F818-ISO PDF datasheet #4
- PIC16F818-ISO PDF datasheet #5
- PIC16F818-ISO PDF datasheet #6
- Current page: 32 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
2.1
2.2
2.2.1
DS31002A-page 2-2
Introduction
Oscillator Configurations
Oscillator Types
The internal oscillator circuit is used to generate the device clock. The device clock is required
for the device to execute instructions and for the peripherals to function. Four device clock peri-
ods generate one internal instruction clock (T
There are up to eight different modes which the oscillator may have. There are two modes which
allow the selection of the internal RC oscillator clock out (CLKOUT) to be driven on an I/O pin, or
allow that I/O pin to be used for a general purpose function. The oscillator mode is selected by
the device configuration bits. The device configuration bits are nonvolatile memory locations and
the operating mode is determined by the value written during device programming. The oscillator
modes are:
• LP
• XT
• HS
• RC
• EXTRC External Resistor/Capacitor
• EXTRC External Resistor/Capacitor with CLKOUT
• INTRC Internal 4 MHz Resistor/Capacitor
• INTRC Internal 4 MHz Resistor/Capacitor with CLKOUT
These oscillator options are made available to allow a single device type the flexibility to fit appli-
cations with different oscillator requirements. The RC oscillator option saves system cost while
the LP crystal option saves power. Configuration bits are used to select the various options. For
more details on the device configuration bits, see the
Mid-Range devices can have up to eight different oscillator modes. The user can program up to
three device configuration bits (FOSC2, FOSC1 and FOSC0) to select one of these eight modes:
• LP
• XT
• HS
• RC
• EXTRC External Resistor/Capacitor
• EXTRC External Resistor/Capacitor with CLKOUT
• INTRC Internal 4 MHz Resistor/Capacitor
• INTRC Internal 4 MHz Resistor/Capacitor with CLKOUT
The main difference between the LP, XT, and HS modes is the gain of the internal inverter of the
oscillator circuit which allows the different frequency ranges.
mation to aid in selecting an oscillator mode. In general, use the oscillator option with the lowest
possible gain which still meet specifications. This will result in lower dynamic currents (I
frequency range of each oscillator mode is the recommended (tested) frequency cutoffs, but the
selection of a different gain mode is acceptable as long as a thorough validation is performed
(voltage, temperature, component variations (Resistor, Capacitor, and internal microcontroller
oscillator circuitry)).
The RC mode and the EXTRC with CLKOUT mode have the same functionality. They are named
like this to help describe their operation vs. the other oscillator modes.
Low Frequency (Power) Crystal
Crystal/Resonator
High Speed Crystal/Resonator
External Resistor/Capacitor (same as EXTRC with CLKOUT)
Low Frequency (Power) Crystal
Crystal/Resonator
High Speed Crystal/Resonator
External Resistor/Capacitor (same as EXTRC with CLKOUT)
CY
) cycle.
“Device Characteristics”
Table 2-1
1997 Microchip Technology Inc.
and
Table 2-2
section.
give infor-
DD
). The
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