PIC24F08KA101-I/MQ Microchip Technology, PIC24F08KA101-I/MQ Datasheet - Page 16
![IC PIC MCU FLASH 1KX8 20-QFN](/photos/6/98/69844/c04-139_mq_sml.jpg)
PIC24F08KA101-I/MQ
Manufacturer Part Number
PIC24F08KA101-I/MQ
Description
IC PIC MCU FLASH 1KX8 20-QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr
Datasheets
1.MA240017.pdf
(254 pages)
2.PIC24F04KA201-ISS.pdf
(48 pages)
3.PIC24F16KA101-ISS.pdf
(18 pages)
Specifications of PIC24F08KA101-I/MQ
Program Memory Type
FLASH
Program Memory Size
8KB (2.75K x 24)
Package / Case
20-VQFN
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
18
Eeprom Size
512 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24F
Core
PIC
Data Bus Width
16 bit
Data Ram Size
1.5 KB
Interface Type
I2C/IrDA/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
18
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM240001
Minimum Operating Temperature
- 40 C
On-chip Adc
9-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
PIC24F16KA102 FAMILY
APPENDIX A:
Rev A Document (6/2009)
Initial release of this document; issued for revision A5.
Includes silicon issues 1 (CTMU), 2 (Resets – BOR),
3 (Core – ICSP), 4 (Core – Deep Sleep), 5 (Memory –
Code Protection), 6 (Comparator) and 7 (SPI –
Enhanced Buffer Mode). Includes data sheet clarifica-
tions 1 (Memory), 2 (Electrical Specifications – AC
Specifications), 3-6 (Electrical Specifications – DC
Specifications), 7 (A/D) and 8 (Comparators).
Rev B Document (6/2009)
Revision issued for silicon revision A6. Existing silicon
issues 1 (CTMU), 2 (Resets – BOR), 4 (Core – Deep
Sleep), 6 (Comparator) and 7 (SPI – Enhanced Buffer
Mode) added to revision A6. No new issues added.
Rev C Document (10/2009)
Revision issued for silicon revision A7. Existing silicon
issues 1 (CTMU), 2 (Resets – BOR), 4 (Core – Deep
Sleep), 6 (Comparator) and 7 (SPI – Enhanced Buffer
Mode) added to revision A7. Added new silicon issue 8
(I/O Ports – PORTA and PORTB).
To revision B of the data sheet, adds data sheet clarifi-
cations 9 (Pin Diagrams), 10 (A/D Converter –
AD1CHS Register), 11 (A/D Converter – AD1CHS
Register), 12 (Special Features – Configuration Bits),
13 (Power-Saving Features) and 14 (Electrical
Specifications – AC Specifications).
Rev D Document (10/2009)
Typographic correction: updated
rect associations between silicon issues and silicon
revisions.
Rev E Document (4/2010)
Added new silicon issue 9 (I/O Ports – PORTA and
PORTB) to all silicon revisions.
Updated existing silicon issue 8 to include additional
interactions and work arounds between RA0 and RB0.
Added
Specifications – DC Specifications) to revision B of the
data sheet.
Updated revision history to include entry for revision D.
DS80473F-page 16
data
sheet
DOCUMENT
REVISION HISTORY
clarification
Table 2
15
with the cor-
(Electrical
Rev F Document (11/2010)
Revision issued for silicon revision B0. Existing silicon
issues 2 (Resets – BOR) and 6 (Comparator) added to
revision B0.
Amended existing silicon issue 8 (I/O Ports – PORTA
and PORTB), to change “digital input” to analog input”
at the end of the fourth paragraph.
Added new silicon issue 10 (Core – Low Power BOR)
to silicon revisions A5, A6 and A7.
Added new silicon issues 11, 12 (Comparator) and
13 (Core – Doze Mode) to silicon revisions A5, A6 and
A7.
Removed data sheet clarification 16 (Electrical
Specifications – DC Specifications) to revision B of the
data sheet.
Removed data sheet clarification 6 (Electrical Specifi-
cations – DC Specifications) and combined it with data
sheet clarification 16 which is now data sheet
clarification 15.
2010 Microchip Technology Inc.