PIC16F628A-I/P Microchip Technology, PIC16F628A-I/P Datasheet - Page 164

• Manufacturer Part Number: PIC16F628A-I/P
• Description: IC MCU FLASH 2KX14 EEPROM 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F628A-I/P

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 128 x 8
• Ram Size: 224 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 224 B
• Interface Type: SCI/USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• Package: 18PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3DBF648 - BOARD DAUGHTER ICEPIC3AC162053 - HEADER INTERFACE ICD,ICD2 18DIPACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F627A/628A/648A
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS40044F-page 162
Note:
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
1
N
2
b
b1
3
D
Dimension Limits
Units
eB
A2
A1
E1
b1
N
A
E
D
e
L
c
b
E1
A2
.115
.015
.300
.240
.880
.115
.008
.045
.014
MIN
–
–
L
.100 BSC
INCHES
NOM
.310
.900
.130
.060
.018
.130
.250
.010
18
–
–
–
Microchip Technology Drawing C04-007B
© 2007 Microchip Technology Inc.
E
MAX
.210
.195
.325
.280
.920
.150
.014
.070
.022
.430
B
–
c