PIC18F23K20-I/SP Microchip Technology, PIC18F23K20-I/SP Datasheet - Page 5

• Manufacturer Part Number: PIC18F23K20-I/SP
• Description: IC PIC MCU FLASH 4KX16 28-DIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F23K20-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 8KB (4K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: CCP/ECCP/EUSART/I2C/MSSP/SPI
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

10. Module: Program Flash Memory
 2010 Microchip Technology Inc.
The write/erase endurance of the Program Flash
Memory is limited to 1K cycles when V
3V. Endurance degrades when V
Work around
For data tables in Program Flash Memory use
error correction method that stores data in multiple
locations.
Affected Silicon Revisions
PIC18F23/43K20
A0
X
A1
X
DD
is below 3V.
DD
is above
11. Module: ADC
• The potential for failures increases over the
• The potential for failures is highest at low V
After extended stress the Most Significant bit
(MSb) of the ADC conversion result can become
stuck at ‘0’. Conversions resulting in code 511 or
less are still accurate, but conversions that
should result in codes greater than 511 are
instead pinned at 511.
The potential for failures is a function of several
factors:
Work around
Affected Silicon Revisions
PIC18F23/43K20
1. Restrict the input voltage to less than 1/2 of
2. Use manual acquisition time (ACQT<2:0> =
A0
life of the part. No failures have ever been
seen for accelerated stress estimated to be
equivalent to 34 years at room temperature.
The failure rate after accelerated stress esti-
mated to be equivalent to 146 years at room
temperature can be as high as 10% for V
1.8V. The time to failure will decrease as the
operating temperature increases.
and decreases as V
X
the ADC voltage reference so that the
expected result is always a code less than
or equal to 511.
000) and put the part to Sleep after each
conversion.
PIC18F23/43K20
A1
DD
increases.
DS80469C-page 5
DD
DD
=