PIC16F724-I/PT Microchip Technology, PIC16F724-I/PT Datasheet - Page 11
![IC PIC MCU FLASH 4KX14 44TQFP](/photos/6/82/68251/c04-076_pt_sml.jpg)
PIC16F724-I/PT
Manufacturer Part Number
PIC16F724-I/PT
Description
IC PIC MCU FLASH 4KX14 44TQFP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.AC164112.pdf
(302 pages)
2.PIC16F722-ISS.pdf
(8 pages)
3.PIC16F722-ISS.pdf
(10 pages)
4.PIC16F722-ISS.pdf
(32 pages)
5.PIC16F722-ISS.pdf
(2 pages)
6.PIC16F722-ISS.pdf
(8 pages)
7.PIC16LF724-EP.pdf
(266 pages)
Specifications of PIC16F724-I/PT
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
44-TQFP, 44-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 14x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C/SCI/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
36
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPAC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F724-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F724-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Fixed Voltage Reference......................................................................................................................................................... 107
11.0 Timer0 Module ........................................................................................................................................................................ 109
12.0 Timer1 Module with Gate Control............................................................................................................................................ 113
13.0 Timer2 Module ........................................................................................................................................................................ 125
14.0 Capacitive Sensing Module..................................................................................................................................................... 127
15.0 Capture/Compare/PWM (CCP) Module .................................................................................................................................. 133
16.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) .......................................................... 143
17.0 SSP Module Overview ............................................................................................................................................................ 165
18.0 Program Memory Read ........................................................................................................................................................... 187
19.0 Power-Down Mode (Sleep) ..................................................................................................................................................... 191
20.0 In-Circuit Serial Programming™ (ICSP™) .............................................................................................................................. 193
21.0 Instruction Set Summary ......................................................................................................................................................... 195
22.0 Development Support.............................................................................................................................................................. 205
23.0 Electrical Specifications........................................................................................................................................................... 209
24.0 DC and AC Characteristics Graphs and Charts ...................................................................................................................... 239
25.0 Packaging Information............................................................................................................................................................. 241
Appendix A: Data Sheet Revision History......................................................................................................................................... 253
Appendix B: Migrating From Other PIC
Index ................................................................................................................................................................................................. 255
The Microchip Web Site .................................................................................................................................................................... 261
Customer Change Notification Service ............................................................................................................................................. 261
Customer Support ............................................................................................................................................................................. 261
Reader Response ............................................................................................................................................................................. 262
Product Identification System ........................................................................................................................................................... 263
© 2008 Microchip Technology Inc.
Device Overview ....................................................................................................................................................................... 11
Memory Organization ................................................................................................................................................................ 17
Resets ....................................................................................................................................................................................... 31
Interrupts ................................................................................................................................................................................... 41
Low Dropout (LDO) Voltage Regulator ..................................................................................................................................... 49
I/O Ports .................................................................................................................................................................................... 51
Oscillator Module....................................................................................................................................................................... 87
Device Configuration ................................................................................................................................................................. 93
Analog-to-Digital Converter (ADC) Module ............................................................................................................................... 97
®
Devices............................................................................................................................. 253
Preliminary
PIC16F72X/PIC16LF72X
DS41341B-page 9