PIC16F886-I/SS Microchip Technology, PIC16F886-I/SS Datasheet - Page 209
![IC PIC MCU FLASH 8KX14 28SSOP](/photos/6/81/68119/150-28-ssop_sml.jpg)
PIC16F886-I/SS
Manufacturer Part Number
PIC16F886-I/SS
Description
IC PIC MCU FLASH 8KX14 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F883-ISO.pdf
(288 pages)
Specifications of PIC16F886-I/SS
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM164123 - KIT MANAGEMENT SYSTEM PICDEMAC164307 - MODULE SKT FOR PM3 28SSOPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F886-I/SS
Manufacturer:
MICROCHI
Quantity:
10 000
Company:
Part Number:
PIC16F886-I/SS
Manufacturer:
OKI
Quantity:
560
- PIC16F616T-ISL PDF datasheet
- MCP1631RD-MCC2 PDF datasheet #2
- PIC16F882-ISS PDF datasheet #3
- PIC16F882-ISS PDF datasheet #4
- PIC16F883-ISO PDF datasheet #5
- Current page: 209 of 328
- Download datasheet (6Mb)
13.4.16.3
Bus collision occurs during a Stop condition if:
a)
b)
FIGURE 13-26:
FIGURE 13-27:
© 2009 Microchip Technology Inc.
After the SDA pin has been de-asserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
After the SCL pin is de-asserted, SCL is
sampled low before SDA goes high.
SDA
SCL
PEN
BCLIF
P
SSPIF
SSPIF
BCLIF
SDA
PEN
SCL
Bus Collision During a Stop
Condition
P
BUS COLLISION DURING A STOP CONDITION (CASE 1)
BUS COLLISION DURING A STOP CONDITION (CASE 2)
Assert SDA
T
SDA asserted low
BRG
T
BRG
PIC16F882/883/884/886/887
T
BRG
T
BRG
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD<6:0>
and counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 13-26). If the SCL pin is sam-
pled low before SDA is allowed to float high, a bus col-
lision occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 13-27).
SCL goes low before SDA goes high,
set BCLIF
T
BRG
T
BRG
‘
‘
0
0
DS41291F-page 207
’
’
SDA sampled
low after T
set BCLIF
‘
‘
0
0
’
’
BRG
,
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