PIC16F722-I/MV Microchip Technology, PIC16F722-I/MV Datasheet - Page 224
![IC MCU 8BIT 3.5KB FLASH 28UQFN](/photos/12/13/121305/c04-152_mv_sml.jpg)
PIC16F722-I/MV
Manufacturer Part Number
PIC16F722-I/MV
Description
IC MCU 8BIT 3.5KB FLASH 28UQFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.AC164112.pdf
(302 pages)
2.PIC16F722-ISS.pdf
(10 pages)
3.PIC16F722-ISS.pdf
(2 pages)
4.PIC16F722-ISS.pdf
(8 pages)
Specifications of PIC16F722-I/MV
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-UFQFN Exposed Pad
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
25
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C, SPI, AUSART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
25
Number Of Timers
3
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 11 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- AC164112 PDF datasheet
- PIC16F722-ISS PDF datasheet #2
- PIC16F722-ISS PDF datasheet #3
- PIC16F722-ISS PDF datasheet #4
- Current page: 224 of 302
- Download datasheet (5Mb)
PIC16F72X/PIC16LF72X
TABLE 23-1:
DS41341E-page 224
Standard Operating Conditions (unless otherwise stated)
Operating temperature
OS01
OS02
OS03
OS04*
OS05*
Note 1: Instruction cycle period (T
Param
No.
*
†
F
T
T
TosH,
TosL
TosR,
TosF
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external
clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
These parameters are characterized but not tested.
OSC
CY
Sym.
OSC
External CLKIN Frequency
Oscillator Frequency
External CLKIN Period
Oscillator Period
Instruction Cycle Time
External CLKIN High,
External CLKIN Low
External CLKIN Rise,
External CLKIN Fall
CLOCK OSCILLATOR TIMING REQUIREMENTS
-40°C ≤ T
Characteristic
A
CY
(1)
≤ +125°C
) equals four times the input oscillator time base period. All specified values are based on
(1)
(1)
(1)
(1)
Min.
250
250
250
200
100
DC
DC
DC
DC
DC
0.1
27
50
50
50
20
—
—
1
2
0
0
0
32.768
Typ†
30.5
T
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CY
10,000
1,000
Max.
DC
37
20
20
20
—
—
—
—
—
—
4
4
∞
∞
∞
∞
∞
∞
∞
4
Units
MHz
MHz
MHz
MHz
MHz
MHz
kHz
kHz
μs
ns
ns
ns
μs
ns
ns
ns
ns
μs
ns
ns
ns
ns
ns
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
EC Oscillator mode
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
RC Oscillator mode
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
EC Oscillator mode
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
RC Oscillator mode
T
LP oscillator
XT oscillator
HS oscillator
LP oscillator
XT oscillator
HS oscillator
CY
© 2009 Microchip Technology Inc.
= 4/F
OSC
Conditions
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