PIC16F676-I/SL Microchip Technology, PIC16F676-I/SL Datasheet - Page 96

• Manufacturer Part Number: PIC16F676-I/SL
• Description: IC MCU FLASH 1K W/AD 14-SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F676-I/SL

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 12
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Controller Family/series: PIC16F
• No. Of I/o's: 12
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 64Byte
• Cpu Speed: 20MHz
• No. Of Timers: 2
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MIL
• Connectivity: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC16F676-I/SLG; PIC16F676-I/SLG

PIC16F630/676
12.9
FIGURE 12-5:
TABLE 12-1:
DS40039F-page 96
Note 1: Instruction cycle period (T
Param
No.
CLKOUT
1
2
3
4
*
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
OSC1
AC CHARACTERISTICS: PIC16F630/676 (INDUSTRIAL, EXTENDED)
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock)
for all devices.
These parameters are characterized but not tested.
and are not tested.
F
T
T
TosL,
TosH
TosR,
TosF
OSC
CY
Sym
OSC
EXTERNAL CLOCK TIMING REQUIREMENTS
External CLKIN Frequency
Oscillator Frequency
External CLKIN Period
Oscillator Period
Instruction Cycle Time
External CLKIN (OSC1) High
External CLKIN Low
External CLKIN Rise
External CLKIN Fall
EXTERNAL CLOCK TIMING
Q4
Characteristic
CY
(1)
) equals four times the input oscillator time-base period. All specified values are
Q1
(1)
1
(1)
(1)
(1)
100 *
Min
250
250
250
200
20*
DC
DC
DC
DC
DC
0.1
27
50
50
27
50
—
—
2*
—
—
—
5
1
Q2
Typ†
250
T
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4
CY
2
3
10,000
1,000
Max
200
DC
50*
25*
15*
Q3
37
20
20
37
—
20
—
—
—
—
—




4
4
4
3
Units
MHz XT mode
MHz HS mode
MHz EC mode
MHz INTOSC mode
MHz RC Osc mode
MHz XT Osc mode
MHz HS Osc mode
kHz
kHz
s
ns
ns
ns
s
ns
ns
ns
ns
ns
s
ns
ns
ns
ns
ns
LP Osc mode
LP Osc mode
LP Osc mode
HS Osc mode
EC Osc mode
XT Osc mode
LP Osc mode
INTOSC mode
RC Osc mode
XT Osc mode
HS Osc mode
T
LP oscillator, T
HS oscillator, T
XT oscillator, T
LP oscillator
XT oscillator
HS oscillator
Q4
CY
4
 2010 Microchip Technology Inc.
= 4/F
4
OSC
Conditions
OSC
OSC
OSC
Q1
L/H duty cycle
L/H duty cycle
L/H duty cycle