PIC16F716-I/SO Microchip Technology, PIC16F716-I/SO Datasheet - Page 66

• Manufacturer Part Number: PIC16F716-I/SO
• Description: IC PIC MCU FLASH 2KX14 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F716-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 18-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 13
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: RS- 232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 8-bit
• Package: 18SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILI3-DB16F716 - BOARD DAUGHTER ICEPIC3AC162054 - HEADER INTERFACE ICD2 16F716AC164010 - MODULE SKT PROMATEII DIP/SOIC
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F716
9.2.3
For timing insensitive applications, the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the
resistor (R
operating temperature. In addition to this, the oscillator
frequency will vary from unit-to-unit due to normal
process
difference in lead frame capacitance between package
types will also affect the oscillation frequency,
especially for low C
take into account variation due to tolerance of external
R and C components used. Figure 9-3 shows how the
R/C combination is connected to the PIC16F716.
FIGURE 9-3:
9.3
The PIC16F716 differentiates between various kinds of
Reset:
• Power-on Reset (POR)
• MCLR Reset during normal operation
• MCLR Reset during Sleep
• WDT Reset (during normal operation)
• WDT Wake-up (during Sleep)
• Brown-out Reset (BOR)
Some registers are not affected in any Reset condition;
their status is unknown on POR and unchanged in any
other Reset. Most other registers are reset to a “Reset
state” on Power-on Reset (POR), on the MCLR and
WDT Reset, on MCLR Reset during Sleep and
Brown-out Reset (BOR). They are not affected by a
WDT Wake-up, which is viewed as the resumption of
normal operation. The TO and PD bits are set or
cleared differently in different Reset situations as indi-
cated in Table 9-4. These bits are used in software to
determine the nature of the Reset. See Table 9-6 for a
full description of Reset states of all registers.
DS41206B-page 64
Recommended values:
3 kΩ ≤ R
10 kΩ ≤ R
C
C
V
R
EXT
EXT
SS
EXT
V
> 20 pF
DD
Reset
EXT
EXT
parameter
EXT
RC OSCILLATOR
≤ 100 kΩ (V
≤ 100 kΩ (V
) and capacitor (C
F
OSC
EXT
/4
RC OSCILLATOR MODE
OSC1
variation.
values. The user also needs to
DD
OSC2/CLKOUT
DD
≥ 3.0V)
≥ 3.0V)
EXT
Furthermore,
) values and the
PIC16F716
Internal
clock
the
A simplified block diagram of the On-chip Reset circuit
is shown in Figure 9-5.
The PIC
the MCLR Reset path. The filter will detect and ignore
small pulses.
It should be noted that a WDT Reset does not drive the
MCLR pin low.
9.4
A Power-on Reset pulse is generated on-chip when
V
just tie the MCLR pin directly (or through a resistor) to
V
usually needed to create a Power-on Reset. A
maximum rise time for V
D004). For a slow rise time, see Figure 9-4.
When the device starts normal operation (exits the
Reset
(voltage, frequency, temperature,...) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met. Brown-out Reset may be used to
meet the start-up conditions.
FIGURE 9-4:
DD
DD
Note 1:
. This will eliminate external RC components
rise is detected. To take advantage of the POR,
2:
3:
®
condition),
Power-On Reset (POR)
microcontrollers have an MCLR noise filter in
External Power-on Reset circuit is required
only if V
diode D helps discharge the capacitor quickly
when V
R < 40 kΩ is recommended to make sure that
voltage drop across R does not violate the
device’s electrical specification.
R1 = 100Ω to 1 kΩ will limit any current
flowing into MCLR from external capacitor C
in the event of MCLR/V
to Electrostatic Discharge (ESD) or Electrical
Overstress
V
DD
R
DD
DD
C
V
device
powers down.
power-up slope is too slow. The
DD
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW V
(EOS).
© 2007 Microchip Technology Inc.
DD
R1
is specified (parameter
operating
DD
PP
PIC16F716
MCLR
pin breakdown due
POWER-UP)
parameters