PIC12F615-I/MF Microchip Technology, PIC12F615-I/MF Datasheet - Page 211
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F615-I/MF
Manufacturer Part Number
PIC12F615-I/MF
Description
IC PIC MCU FLASH 1KX14 8DFN
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(26 pages)
3.PIC12F609T-ISN.pdf
(8 pages)
4.PIC12F615-EMF.pdf
(196 pages)
Specifications of PIC12F615-I/MF
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-DFN
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
5
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC164324 - MODULE SKT FOR MPLAB 8DFN/16QFN
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC12F609T-ISN PDF datasheet
- PIC12F609T-ISN PDF datasheet #2
- PIC12F609T-ISN PDF datasheet #3
- PIC12F615-EMF PDF datasheet #4
- Current page: 211 of 212
- Download datasheet (2Mb)
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
2010 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC12F609, PIC12F609T
PIC12F615, PIC12F615T
PIC12F617, PIC12F617T
H
I
E
P
SN
MS
MF
MD
QTP, SQTP or ROM Code; Special Requirements
(blank otherwise)
Range
X
=
=
=
=
=
= -40C to +150C
= -40C to
= -40C to +125C
(4x4)(DFN)
Plastic DIP (PDIP)
8-lead Small Outline (150 mil) (SOIC)
Micro Small Outline (MSOP)
8-lead Plastic Dual Flat, No Lead (3x3) (DFN)
8-lead Plastic Dual Flat, No Lead
PIC12F609/615/617/12HV609/615
Package
/XX
+85C
(1,2)
(1)
(1)
(1)
, PIC12HV609, PIC12HV609T
, PIC12HV615, PIC12HV615T
(High Temp)
(Industrial)
(Extended)
Pattern
XXX
(3)
(1)
(1)
,
,
Examples:
a)
b)
c)
d)
e)
f)
g)
h)
i)
Note 1:
PIC12F615-E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP pattern #301
PIC12F615-I/SN = Industrial Temp., SOIC
package, 20 MHz
PIC12F615T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
PIC12F609T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
PIC12HV615T-E/MF = Tape and Reel,
Extended Temp., 3x3 DFN, 20 MHz
PIC12HV609T-E/MF = Tape and Reel,
Extended Temp., 3x3 DFN, 20 MHz
PIC12F617T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
PIC12F617-I/P = Industrial Temp., PDIP pack-
age, 20 MHz
PIC12F615-H/SN = High Temp., SOIC pack-
age, 20 MHz
2:
3:
T
DFN packages only.
Not available for PIC12F617.
High Temp. available for PIC12F615 only.
= in tape and reel for MSOP, SOIC and
.
DS41302D-page 211
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