PIC12HV615-I/SN Microchip Technology, PIC12HV615-I/SN Datasheet - Page 211

• Manufacturer Part Number: PIC12HV615-I/SN
• Description: IC PIC MCU FLASH 1KX14 8SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12HV615-I/SN

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-SOIC (3.9mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 5
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12H
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS-232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2010 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC12F609, PIC12F609T
PIC12F615, PIC12F615T
PIC12F617, PIC12F617T
H
I
E
P
SN
MS
MF
MD
QTP, SQTP or ROM Code; Special Requirements
(blank otherwise)
Range
X
=
=
=
=
=
= -40C to +150C
= -40C to
= -40C to +125C
(4x4)(DFN)
Plastic DIP (PDIP)
8-lead Small Outline (150 mil) (SOIC)
Micro Small Outline (MSOP)
8-lead Plastic Dual Flat, No Lead (3x3) (DFN)
8-lead Plastic Dual Flat, No Lead
PIC12F609/615/617/12HV609/615
Package
/XX
+85C
(1,2)
(1)
(1)
(1)
, PIC12HV609, PIC12HV609T
, PIC12HV615, PIC12HV615T
(High Temp)
(Industrial)
(Extended)
Pattern
XXX
(3)
(1)
(1)
,
,
Examples:
a)
b)
c)
d)
e)
f)
g)
h)
i)
Note 1:
PIC12F615-E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP pattern #301
PIC12F615-I/SN = Industrial Temp., SOIC
package, 20 MHz
PIC12F615T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
PIC12F609T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
PIC12HV615T-E/MF = Tape and Reel,
Extended Temp., 3x3 DFN, 20 MHz
PIC12HV609T-E/MF = Tape and Reel,
Extended Temp., 3x3 DFN, 20 MHz
PIC12F617T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
PIC12F617-I/P = Industrial Temp., PDIP pack-
age, 20 MHz
PIC12F615-H/SN = High Temp., SOIC pack-
age, 20 MHz
2:
3:
T
DFN packages only.
Not available for PIC12F617.
High Temp. available for PIC12F615 only.
= in tape and reel for MSOP, SOIC and
.
DS41302D-page 211