PIC16F505-I/ST Microchip Technology, PIC16F505-I/ST Datasheet - Page 105
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PIC16F505-I/ST
Manufacturer Part Number
PIC16F505-I/ST
Description
IC MCU FLASH 1KX12 14TSSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC12F509T-ISN.pdf
(110 pages)
2.PIC16F505-IST.pdf
(4 pages)
3.PIC16F505-IST.pdf
(22 pages)
4.PIC12F509-EMC.pdf
(106 pages)
Specifications of PIC16F505-I/ST
Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
14-TSSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
11
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
72 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162070 - HEADER INTRFC MPLAB ICD2 8/14P
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2007 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
Note:
PART NO.
Device
Tape and Reel available for only the following packages: SOIC, MSOP
and TSSOP.
Temperature
PIC16F505
PIC12F508
PIC12F509
PIC16F505T
PIC12F508T
PIC12F509T
I
E
MC
MS
P
SL
SN
ST
Special Requirements
Range
=
=
X
=
=
=
=
=
=
-40°C to +85°C (Industrial)
-40°C to +125°C (Extended)
(1)
(2)
(2)
8L DFN 2x3 (DUAL Flatpack No-Leads)
Micro-Small Outline Package (MSOP)
Plastic (PDIP)
14L Small Outline, 3.90 mm (SOIC)
8L Small Outline, 3.90 mm Narrow (SOIC)
Thin Shrink Small Outline (TSSOP)
Package
/XX
(4)
Pattern
XXX
Preliminary
(4)
(4)
PIC12F508/509/16F505
(3, 4)
(3, 4)
(4)
Note 1:
Examples:
a)
b)
c)
2:
3:
4:
PIC12F508-E/P 301 = Extended Temp., PDIP
package, QTP pattern #301
PIC12F508-I/SN = Industrial Temp., SOIC
package
PIC12F508T-E/P = Extended Temp., PDIP
package, Tape and Reel
T
T
PIC12F508/PIC12F509 only.
Pb-free.
= in tape and reel SOIC and TSSOP
= in tape and reel SOIC and MSOP
packages only
packages only.
.
DS41236D-page 103