CM453232-R47ML Bourns Inc., CM453232-R47ML Datasheet - Page 2
![INDUCTOR CHIP .47UH 20% 4523 SMD](/photos/28/59/285954/cm453232_sml.jpg)
CM453232-R47ML
Manufacturer Part Number
CM453232-R47ML
Description
INDUCTOR CHIP .47UH 20% 4523 SMD
Manufacturer
Bourns Inc.
Series
CM453232r
Type
Ferrite Corer
Specifications of CM453232-R47ML
Inductance
470nH
Current
545mA
Tolerance
±20%
Dc Resistance (dcr)
320 mOhm Max
Q @ Freq
40 @ 25.2MHz
Self Resonant Freq
145MHz
Package / Case
1812 (4532 Metric)
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Frequency - Test
25.2MHz
Material - Core
Ferrite
Applications
Mobile Communications
Inductance Tolerance
± 20%
Dc Resistance Max
0.32ohm
Dc Current Rating
545mA
Resonant Frequency
145MHz
Q @ Vr F
40
Core Material
Ferrite
Inductor Case Style
1812
No. Of Pins
2
Svhc
No SVHC (15-Dec-2010)
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Shielding
-
Current - Saturation
-
Current - Temperature Rise
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
CM10, CM16, CM20, CM25, CM32
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Model
t1
Packaging Specifications
CM10
CM16
CM20
CM25
CM32
CM45
Reel Dimensions
Packaging
Soldering
Flow Soldering
Model
CM10
CM16
CM20
Model
CM10
CM16
CM20
CM25
CM32
CM45
Flow Soldering
t2
Vapor-phase
Infrared
CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
0.71 (.027) 1.21 (.047) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011) 1.20 (.047)
1.00 (.039) 1.80 (.071) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011) 1.20 (.047)
1.45 (.057) 2.25 (.089) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.00 (.039) 0.25 (.010) 1.55 (.061)
2.40 (.094) 2.90 (.114) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.10 (.043) 0.25 (.010) 1.85 (.073)
2.80 (.110) 3.60 (.142) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059)
3.60 (.142) 4.90 (.193) 12.00 (.472) 5.50 (.217) 1.75 (.069) 8.00 (.315) 2.00 (.079) 4.00 (.157) 1.50 (.059)
Preheat:
100 to 150 °C
2 minutes
min.
W
Chip
Component
A
E
10000 pcs
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
178 (7.008) 60 min. 13 (.512)
3000 pcs
3000 pcs
Quantity
F
A
10 seconds max.
260 °C maximum for 5 seconds (2 wave solder method)
200 °C for a maximum of 30 seconds. Peak of 240 °C for a maximum of 5 seconds.
If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the
board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow.
215 °C for a maximum of 30 seconds.
B
ØDo
260 °C
DIA.
D1
P1
B
Weight
150 g
90 g
90 g
W
P2
Tape running direction
C
P3
F
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
A
Infrared Soldering
D
Model
CM25
CM32
CM45
E
Preheat:
100 to 150 °C
2 minutes
min.
B
2 (.079)
2 (.079)
2 (.079)
2 (.079)
2 (.079)
2 (.079) 13 (.512)
E
Quantity
2000 pcs
2000 pcs
500 pcs
10 seconds max.
30 seconds max.
P1
9 (.354)
9 (.354)
9 (.354)
9 (.354)
9 (.354)
W
230 °C
200 °C
CM45
P2
t1
Weight
100 g
190 g
100 g
t2
P3
Chip
Component
W
E
F
¿D0
Vapor-phase Soldering
A
ØDo
Preheat:
100 to 150 °C
2 minutes
min.
P1
¿D1
—
—
10 seconds max.
30 seconds max.
P2
Tape running direction
E
0.25 (.010) 2.40 (.094)
0.30 (.012) 3.50 (.138)
P3
220 °C
C
t1
D
215 °C
A
t2
B
W
B