FP0705R1-R18-R Coiltronics/Div of Cooper/Bussmann, FP0705R1-R18-R Datasheet - Page 4

INDUCTOR LO PROFILE 180NH 43A

FP0705R1-R18-R

Manufacturer Part Number
FP0705R1-R18-R
Description
INDUCTOR LO PROFILE 180NH 43A
Manufacturer
Coiltronics/Div of Cooper/Bussmann
Series
FLAT-PAC™, FP0705r
Type
Ferrite Corer
Datasheet

Specifications of FP0705R1-R18-R

Inductance
180nH
Current
43A
Current - Saturation
25A
Tolerance
±10%
Dc Resistance (dcr)
0.25 mOhm
Package / Case
0.276" L x 0.276" W x 0.195" H (7.00mm x 7.00mm x 4.95mm)
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Frequency - Test
100kHz
Material - Core
Ferrite
Applications
General Purpose
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Shielding
-
Q @ Freq
-
Self Resonant Freq
-
Current - Temperature Rise
-
Other names
513-1600-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FP0705R1-R18-R
Manufacturer:
COOPER
Quantity:
950
Part Number:
FP0705R1-R18-R
Manufacturer:
EATON/COOPER
Quantity:
20 000
Solder Reflow Profile
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
Average ramp up rate T smax to T p
Liquidous temperature (T
Time at liquidous (t L )
Peak package body temperature (T P )*
Time (t p )** within 5 °C of the specified classification temperature (T c )
Average ramp-down rate (T p to T smax )
Time 25°C to Peak Temperature
** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
05-05-08
* Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum.
25°C
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This
bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, with-
out notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any
technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.
Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in significant injury to the user.
T
T
© 2 0 0 8 C o o p e r B u s s m a n n
P
L
S t . L o u i s , M O 6 3 1 7 8
w w w. c o o p e r b u s s m a n n . c o m
T
smax
T
BU-SB08210
smin
Time 25°C to Peak
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Preheat
A
• Temperature min. (T smin )
• Temperature max. (T smax )
• Time (T smin to T smax ) (t s )
L
t
s
)
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Time
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
t
t
P
Page 4 of 4
Standard SnPb Solder
T
3°C/ Second Max.
6°C/ Second Max.
C
60-120 Seconds
60-150 Seconds
6 Minutes Max.
-5°C
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
Fax: +34 937 362 719
20 Seconds**
+34 937 362 813
Table 1
100°C
150°C
183°C
T T a a b b l l e e 1 1 - - S S t t a a n n d d a a r r d d S S n n P P b b S S o o l l d d e e r r ( ( T T c c ) )
Package
T T a a b b l l e e 2 2 - - L L e e a a d d ( ( P P b b ) ) F F r r e e e e S S o o l l d d e e r r ( ( T T c c ) )
Thickness
<2.5mm
> _ 2.5mm
Package
Thickness
<1.6mm
1.6 – 2.5mm 260°C
>2.5mm
Data Sheet: 4325
Volume
Volume
235°C
220°C
260°C
250°C
Lead (Pb) Free Solder
<350
<350
mm
mm
3°C/ Second Max.
6°C/ Second Max.
60-120 Seconds
60-150 Seconds
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
8 Minutes Max.
3
3
30 Seconds**
Table 2
150°C
200°C
217°C
350 - 2000
Volume
Volume
220°C
220°C
260°C
250°C
245°C
> _ 350
mm
mm
3
3
Volume
>2000
260°C
245°C
245°C
mm
3

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