B82498F3220J EPCOS Inc, B82498F3220J Datasheet - Page 4

INDUCTOR 22NH 700MA 0805 5%

B82498F3220J

Manufacturer Part Number
B82498F3220J
Description
INDUCTOR 22NH 700MA 0805 5%
Manufacturer
EPCOS Inc
Series
SIMIDr
Type
Ceramicr
Datasheet

Specifications of B82498F3220J

Inductance
22nH
Tolerance
±5%
Package / Case
0805 (2012 Metric)
Current
700mA
Dc Resistance (dcr)
80 mOhm Max
Q @ Freq
60 @ 500MHz
Self Resonant Freq
2.5GHz
Mounting Type
Surface Mount
Frequency - Test
250MHz
Material - Core
Ceramic
Applications
General Purpose
Core Material
Ceramic
Dimensions
1.3 mm W x 2 mm L x 1.4 mm H
Shielding
Unshielded
Test Frequency
250 MHz
Maximum Dc Current
700 mAmps
Maximum Dc Resistance
0.08 Ohms
Self Resonant Frequency
2500 MHz
Q Minimum
60
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Saturation
-
Current - Temperature Rise
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
495-1850-2
B82498F3220J000

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
B82498F3220J000
Manufacturer:
EPCOS
Quantity:
60 000
Part Number:
B82498F3220J001
Manufacturer:
EPCOS
Quantity:
60 000
Technical data and measuring conditions
Rated inductance L
Q factor Q
Rated temperature T
Rated current I
Self-resonance frequency f
DC resistance R
Solderability (lead-free)
Resistance to soldering heat
Climatic category
Storage conditions
Weight
Please read Cautions and warnings and
Important notes at the end of this document.
SMT inductors, SIMID series
SIMID 0805-F
min
R
max
R
R
res,min
Measured with impedance analyzer Agilent 4291A and
test fixture Agilent 16197A at frequency f
Pad distance 0.9 ±0.1 (mm)
Short inductance 200 pH unconsidered
Measured with impedance analyzer Agilent 4291A and
test fixture Agilent 16197A at frequency f
Pad distance 0.9 ±0.1 (mm)
Short inductance 200 pH unconsidered
105 °C
Maximum permissible DC with inductance decrease
∆L/L
of ≤ 20 K at rated temperature
Measured with network analyzer Agilent 8720D, 20 °C
Measured at 20 °C
Sn95.5Ag3.8Cu0.7: (245 ±5) °C, (5 ±0.3) s
Wetting of soldering area ≥ 90%
(based on IEC 60068-2-58)
Standard version:
260 °C, 20 s (as referenced in JEDEC J-STD 020C)
Gold-plated terminals:
260 °C, 40 s (as referenced in JEDEC J-STD 020C)
55/125/56 (to IEC 60068-1)
Mounted:
Packaged: −25 °C … +40 °C, ≤ 75% RH
Approx. 10 mg
0
≤ 10% and temperature increase
4
03/08
−55 °C … +125 °C
L
Q
, 0.1 V, 20 °C.
, 20 °C.
B82498F

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