2540-50K2UG 3M, 2540-50K2UG Datasheet - Page 27

• Manufacturer Part Number: 2540-50K2UG
• Description: CONN HEADER 40POS R/A GOLD T/H
• Manufacturer: 3M
• Series: 2500r

Specifications of 2540-50K2UG

• Contact Type: Male Pin
• Connector Type: Header, Shrouded
• Number Of Positions: 40
• Number Of Positions Loaded: All
• Pitch: 0.100" (2.54mm)
• Number Of Rows: 2
• Row Spacing: 0.100" (2.54mm)
• Contact Mating Length: 0.243" (6.17mm)
• Mounting Type: Through Hole, Right Angle
• Termination: Solder
• Contact Finish: Gold
• Contact Finish Thickness: 15µin (0.38µm)
• Color: Gray
• Lead Free Status / RoHS Status: Vendor undefined / RoHS non-compliant
• Features: -
• Fastening Type: -
• Other names: 05111163073; 80400021939

3M.com/interconnects
Assemblies, .80 mm, Input/Output
Shrunk Delta Ribbon (SDR) Cable
Attachment (SATA) Signal Cable
Attachment (SATA) Power Cable
Serial Advanced Technology
Serial Advanced Technology
Series 1MG, 1MF, 1SF
product
Series 5601
Series 5602
3M
™
caBle aSSeMBly SolutionS
• RoHS Compliant
• Supplied as a Complete Assembly
• Supports New AIA Industrial Camera
• 11 Shielded Twisted Twinax Pairs
• Double Overall Shield with Foil and
• Straight and Right Angle
• SDR-to-SDR and MDR-to-SDR
• Mates with 3M SDR and MDR
• RoHS Compliant
• 15-Position Power Cable
• Rugged Over-Molded Construction
• “Y” Type Supports Multiple Devices
• RoHS Compliant
• 7-Position Serial Signal Assembly
• Multiple Variations in Length and
• Point-to-Point Signaling
• Polarized Interface Ensures Proper
• 26 AWG Differential Pairs
• Meets SATA 2.6 Specification
Only
Link
to C/L Frame Grabber Applications
with Four Drain Wires
Outer Braid EMI Shielded Cable
Assembly
Configurations Available
Options Available
Boardmount Products
Provided in Standard Lengths
Interface Attachments
Alignment
FeatureS
®
Standard for Mini C/L Camera
Insulation
Material: Polyvinyl Chloride
Plating
Underplating: 100 µ" [ 2.55 µm ]
Wiping Area: 30 µ" [ 0.76 µm ]
Materials Vary for Connectors,
Cables, Shells and Jackscrews.
See Website for Specifics.
Insulation
Material: High Temperature
Plating
Wiping Area: 30 µ" [ 0.76 µm ]
Solder Tails: 100 µ" [ 2.54 µm ]
Underplating: 50 µ" [ 1.27 µm ]
Insulation
Material: High Temperature
Plating
Wiping Area: 30 µ" [ 0.76 µm ]
Solder Tails: 100 µ" [ 2.54 µm ]
Underplating: 50 µ" [ 1.27 µm ]
Nickel
Minimum Gold
Thermoplastic
Gold
Tin
Nickel
Thermoplastic
Gold
Tin
Nickel
MaterialS
Current Rating: 1 A
Temperature Rating: -20°C to +85°C
Current Rating: 1 A
Temperature Rating: -20°C to +85°
Current Rating: 1 A
Temperature Rating: -20°C to +85°C
perForMance
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