N3408-6002RB 3M, N3408-6002RB Datasheet - Page 6
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N3408-6002RB
Manufacturer Part Number
N3408-6002RB
Description
PROTECT HEADER STRGT 16 CONTACT
Manufacturer
3M
Series
3000r
Type
PCB Plugr
Specifications of N3408-6002RB
Contact Type
Male Pin
Connector Type
Header, Shrouded
Number Of Positions
16
Number Of Positions Loaded
All
Pitch
0.100" (2.54mm)
Number Of Rows
2
Row Spacing
0.100" (2.54mm)
Contact Mating Length
0.240" (6.10mm)
Mounting Type
Through Hole
Termination
Solder
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Color
Black
Agency Approvals
cUL, UL
Angle
Straight
Brand/series
3000 Series
Contact Plating
Gold
Contact Termination Area Plating
200 u in. 60⁄40 Tin⁄Lead
Current, Rating
2 A
Finish, Housing Test
Tin-Lead
Flammability Rating
UL94V-0
Height
0.68 in.
Length, Overall
1.565 "
Length, Pin
0.112 "
Length, Tail
2.84 mm
Material, Contact
Copper Alloy
Material, Housing
Glass Filled Polyester
Material, Insulation
Glass Filled Polyester (PCT)
Mounting Hole Size
0.1 "
Number Of Contacts
16
Pin Spacing
0.1 "
Primary Type
High Temperature
Resistance, Insulation
>1 x 10^9 Ohms @ 500 VDC
Special Features
Four-Wall
Temperature, Operating
-55 to +105 °C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Fastening Type
-
Lead Free Status / Rohs Status
RoHS Compliant part
Other names
5111165065
51111650653
80400027761
MHS16L
N34086002RB
51111650653
80400027761
MHS16L
N34086002RB
Series 5100, 6800, 8500, 9100
6
2 mm x 2 mm, Solder Tail
Headers, 2 mm x 2 mm
Headers, .100" x .100"
Boardmount Pin Strips
Polarized Boardmount
Sockets, .100" x .100"
Sockets and Pin Strip
Sockets and Pin Strip
3M
2 mm, Series 95X
Pin Strip Headers
product
Box Headers
and Sockets
Series 95X
Series 957
Series 929
Series 15
™
BoardMount connector SolutionS
• RoHS Compliant
• Single and Dual Row
• 3 - 80 Positions
• High Temperature Dielectric
• “ No Lead” Wave and Reflow Solder
• Maximizes Use of PC Board Space
• End Stackable Feature
• Mates with Boardmount and
• Available in Straight, Right Angle
• RoHS Compliant
• Maximizes Use of PC Board Space
• High Temperature Dielectric
• “No Lead” Wave and Reflow Solder
• Dual Row Design, 4–80 Pins
• Minimized PC Board
• Mates With Pin Strip Header
• Available in Straight, Right Angle
• RoHS Compliant
• High Temperature Dielectric
• “No Lead” Wave and Reflow Solder
• Maximizes Use of PC Board Space
• Center Slot Polarization
• 10 - 68 Positions
• RoHS Compliant Version Available
• 2-72 Positions
• Single- and Dual-Row Options
• Through-Hole and Through-Board
• Customizable Stack Heights
• High Temperature Insulator Option
• RoHS Compliant
• 10-64 Positions
• Vertical and Right Angle Options
• Center Bump Polarization
• RoHS Compliant Version Available
• 4-60 Positions
• Single and Dual-Row Options
• Surfacemount, Through-Hole
• Customizable Stack Heights
• High Temperature Insulator
Wiremount Products
Through-Hole and Surfacemount
Versions
Compatible
Stacking Heights
Products
Through-Hole, Through-Board and
Surfacemount Versions
Compatible
Prevents Mis-Insertions and
Reduces Insertion Time
Options
from .150" to 1.325"
and Through-Board Options
from .101" to 1.418"
Compatible
FeatureS
Contact
Material: Copper Alloy
Insulation
Material: High Temperature
Color: Black
Flammability UL 94V-0
Plating
Underplating: 1.25–2.5 µm
Wiping Area: 0.25 µm [ 10 µ" ] Gold
Solder Tail Area: 1–3 µm
Contact
Material: Copper Alloy
Insulation
Material: High Temperature
Color: Black
Flammability UL 94V-0
Plating
Underplating: 1.25–2.5 µm
Wiping Area: 0.25 µm [ 10 µ" ] Gold
Solder Tail Area: 1–3 µm
Contact
Material: Square Pin 0.5 mm,
Insulation
Material: High Temperature
Thermoplastic
Color: Black
Flammability UL 94V-0
Plating
Underplating: 1.25–2.5 µm
Wiping Area: 0.25 µm [ 10 µ" ] Gold
Solder Tail Area: 1–3 µm
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Pin Strip Underplating: 50 µ"
Socket Underplating: 100 µ"
Tin Plated Versions Available
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Underplating: 2 µm [ 79 µ" ] Nickel
Wiping Area: 0.3 µm [ 12 µ" ] Gold
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled PCT
Flammability UL 94V-0
Plating
Underplating: 50-150 µ"
Wiping Area: 30 µ" [ 0.76 µm ] Gold
Thermoplastic
[ 100 µ" ] Nickel
[ 40–118 µ’" ] Matte Tin
Thermoplastic
[100 µ" ] Nickel
[ 40–118 µ" ] Matte Tin
Copper Alloy
[ 100 µ" ] Nickel
[ 40–118 µ" ] Matte Tin
(PBT) or PCT (RoHS Compliant)
[ 1.27 µm ] Nickel, Interface: 10 µ"
[ 0.25 µm ] or 30 µ" [ 0.76 µm ] Gold
[ 2.54 mm ] Nickel, Interface: 10 µ"
[ 0.25 µm ] or 30 µ" [ 0.76 µm ] Gold
[ 1.27-3.81 µm ] Nickel
MaterialS
3M.com/interconnects
perForMance
Current Rating: 1 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A, 2 A or 2.5 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A
Temperature Rating: -55°C to +105°C
Current Rating: 1 A
Temperature Rating: -55°C to +105°C