3408-5002 3M, 3408-5002 Datasheet - Page 6

PROTECT HEADER RT/ANG 16 CONTACT

3408-5002

Manufacturer Part Number
3408-5002
Description
PROTECT HEADER RT/ANG 16 CONTACT
Manufacturer
3M
Series
3000r
Type
PCB Plugr
Datasheets

Specifications of 3408-5002

Contact Type
Male Pin
Connector Type
Header, Shrouded
Number Of Positions
16
Number Of Positions Loaded
All
Pitch
0.100" (2.54mm)
Number Of Rows
2
Row Spacing
0.100" (2.54mm)
Contact Mating Length
0.240" (6.10mm)
Mounting Type
Through Hole, Right Angle
Termination
Solder
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Color
Gray
Agency Approvals
cUL, UL
Angle
Right
Brand/series
3000 Series
Contact Plating
Gold
Current, Rating
2 A
Diameter, Hole
2.54 mm
Flammability Rating
UL94V-0
Height
0.68 in.
Length, Ejector/latch
0.100 in. x 0.100 in.
Length, Overall
1.565 "
Length, Pin
0.112 "
Material, Contact
Copper Alloy
Material, Housing
Glass Filled Polyester
Material, Insulation
Glass Filled Polyester (PBT), Glass Filled Polyester (PCT-High Temperature Option)
Mounting Hole Size
0.1 "
Number Of Contacts
16
Pin Spacing
0.1 "
Special Features
Four-Wall
Temperature Rating
-55 to +105 °C
Temperature, Operating
-55 to +105 °C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Fastening Type
-
Other names
5400732724
54007327240
80-6100-9712-5
80610097125
MHR16G
MHR16K
Series 5100, 6800, 8500, 9100
6
2 mm x 2 mm, Solder Tail
Headers, 2 mm x 2 mm
Headers, .100" x .100"
Boardmount Pin Strips
Polarized Boardmount
Sockets, .100" x .100"
Sockets and Pin Strip
Sockets and Pin Strip
3M
2 mm, Series 95X
Pin Strip Headers
product
Box Headers
and Sockets
Series 95X
Series 957
Series 929
Series 15
BoardMount connector SolutionS
• RoHS Compliant
• Single and Dual Row
• 3 - 80 Positions
• High Temperature Dielectric
• “ No Lead” Wave and Reflow Solder
• Maximizes Use of PC Board Space
• End Stackable Feature
• Mates with Boardmount and
• Available in Straight, Right Angle
• RoHS Compliant
• Maximizes Use of PC Board Space
• High Temperature Dielectric
• “No Lead” Wave and Reflow Solder
• Dual Row Design, 4–80 Pins
• Minimized PC Board
• Mates With Pin Strip Header
• Available in Straight, Right Angle
• RoHS Compliant
• High Temperature Dielectric
• “No Lead” Wave and Reflow Solder
• Maximizes Use of PC Board Space
• Center Slot Polarization
• 10 - 68 Positions
• RoHS Compliant Version Available
• 2-72 Positions
• Single- and Dual-Row Options
• Through-Hole and Through-Board
• Customizable Stack Heights
• High Temperature Insulator Option
• RoHS Compliant
• 10-64 Positions
• Vertical and Right Angle Options
• Center Bump Polarization
• RoHS Compliant Version Available
• 4-60 Positions
• Single and Dual-Row Options
• Surfacemount, Through-Hole
• Customizable Stack Heights
• High Temperature Insulator
Wiremount Products
Through-Hole and Surfacemount
Versions
Compatible
Stacking Heights
Products
Through-Hole, Through-Board and
Surfacemount Versions
Compatible
Prevents Mis-Insertions and
Reduces Insertion Time
Options
from .150" to 1.325"
and Through-Board Options
from .101" to 1.418"
Compatible
FeatureS
Contact
Material: Copper Alloy
Insulation
Material: High Temperature
Color: Black
Flammability UL 94V-0
Plating
Underplating: 1.25–2.5 µm
Wiping Area: 0.25 µm [ 10 µ" ] Gold
Solder Tail Area: 1–3 µm
Contact
Material: Copper Alloy
Insulation
Material: High Temperature
Color: Black
Flammability UL 94V-0
Plating
Underplating: 1.25–2.5 µm
Wiping Area: 0.25 µm [ 10 µ" ] Gold
Solder Tail Area: 1–3 µm
Contact
Material: Square Pin 0.5 mm,
Insulation
Material: High Temperature
Thermoplastic
Color: Black
Flammability UL 94V-0
Plating
Underplating: 1.25–2.5 µm
Wiping Area: 0.25 µm [ 10 µ" ] Gold
Solder Tail Area: 1–3 µm
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Pin Strip Underplating: 50 µ"
Socket Underplating: 100 µ"
Tin Plated Versions Available
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Underplating: 2 µm [ 79 µ" ] Nickel
Wiping Area: 0.3 µm [ 12 µ" ] Gold
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled PCT
Flammability UL 94V-0
Plating
Underplating: 50-150 µ"
Wiping Area: 30 µ" [ 0.76 µm ] Gold
Thermoplastic
[ 100 µ" ] Nickel
[ 40–118 µ’" ] Matte Tin
Thermoplastic
[100 µ" ] Nickel
[ 40–118 µ" ] Matte Tin
Copper Alloy
[ 100 µ" ] Nickel
[ 40–118 µ" ] Matte Tin
(PBT) or PCT (RoHS Compliant)
[ 1.27 µm ] Nickel, Interface: 10 µ"
[ 0.25 µm ] or 30 µ" [ 0.76 µm ] Gold
[ 2.54 mm ] Nickel, Interface: 10 µ"
[ 0.25 µm ] or 30 µ" [ 0.76 µm ] Gold
[ 1.27-3.81 µm ] Nickel
MaterialS
3M.com/interconnects
perForMance
Current Rating: 1 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A, 2 A or 2.5 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A
Temperature Rating: -55°C to +105°C
Current Rating: 1 A
Temperature Rating: -55°C to +105°C

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