SF-1206S500-2 Bourns Inc., SF-1206S500-2 Datasheet - Page 2
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SF-1206S500-2
Manufacturer Part Number
SF-1206S500-2
Description
FUSE 5.0A SLOW SMD 1206
Manufacturer
Bourns Inc.
Series
SinglFuse™ SFr
Type
Slow Blowr
Datasheet
1.SF-1206S100-2.pdf
(4 pages)
Specifications of SF-1206S500-2
Fuse Type
Slow Blow, Time Lag
Voltage - Rated
24VDC
Current
5A
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W x 0.024" H (3.20mm x 1.60mm x 0.60mm)
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C
Dc Cold Resistance
0.01 Ohm
Melting I²t
2.533
Current Rating
5 Amps
Voltage Rating
24 Volts
Fuse Size / Group
1206
Termination Style
SMD/SMT
Body Material
Ceramic
Dimensions
3.2 mm L x 1.55 mm W
Product
Surface Mount Fuse
Interrupt Rating
50 Amps
Mounting Style
SMD/SMT
Operating Temperature Range
- 20 C to + 120 C
Resistance
10 mOhms
Voltage Rating Vdc
24V
Fuse Current
5A
Breaking Capacity
50A @ 24VDC
Blow Characteristic
Slow Blow
Fuse Case Style
1206
Svhc
No SVHC (15-Dec-2010)
Approval Category
UL Recognised
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Color
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
SF-1206S500-2TR
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SinglFuse
PACKAGING: 5,000 pcs./reel
Operating Temperature ................................................................................. -40 °C to +105 °C
Storage Conditions
Solder Refl ow Recommendations
Product Dimensions
Thermal Derating Curve
Portable memory
LCD monitors
Disk drives
PDAs
Digital cameras
DVDs
Temperature ............................................................................................... +5 °C to +35 °C
Humidity .........................................................................................................40 % to 75 %
Shelf Life ...........................................................................2 years from manufacturing date
250
200
150
100
SF-1206S Series - Slow Blow Surface Mount Fuses
50
(.020 ± .012)
0.5 ± 0.3
™
(.122 ± .004)
SF-1206S Series Applications
120
110
100
3.1 ± 0.1
90
80
-20
180 °C
150 °C
(.020 ± .012)
0.5 ± 0.3
0
AMBIENT TEMPERATURE (°C)
20
(.061 ± .004)
PRE-HEATING ZONE
1.55 ± 0.1
90 ± 30 Seconds
HEATING TIME
Peak: 250 +0/-5 °C
40
230 °C or higher
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Cell phones
Rechargeable battery packs
Battery chargers
Set top boxes
Industrial controllers
30 ± 10 Seconds
60
DIMENSIONS:
(.020 ± .008)
0.5 ± 0.2
80
SOLDERING ZONE
100
(.020 ± .008)
0.5 ± 0.2
(INCHES)
MM
(.024 ± .004)
120
0.6 ± 0.1
Customers should verify actual device performance in their specifi c applications.
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
Sn PLATING
Recommended Pad Layout
Construction & Material Content
Specifi cations are subject to change without notice.
CERAMIC SUBSTRATE
(.050)
1.27
(.150)
3.81
FUSE ELEMENT
OVERCOAT
Cu / Ni PLATING
(.080)
2.03