T520V337M2R5ATE025 Kemet, T520V337M2R5ATE025 Datasheet - Page 16
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T520V337M2R5ATE025
Manufacturer Part Number
T520V337M2R5ATE025
Description
CAP TANT 330UF 2.5V 20% SMD
Manufacturer
Kemet
Series
KO Cap T520r
Type
Moldedr
Datasheet
1.T520D227M006ATE015.pdf
(24 pages)
Specifications of T520V337M2R5ATE025
Capacitance
330µF
Voltage - Rated
2.5V
Tolerance
±20%
Esr (equivalent Series Resistance)
25.0 mOhm
Operating Temperature
-55°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
2917 (7343 Metric)
Size / Dimension
0.287" L x 0.169" W (7.30mm x 4.30mm)
Height
0.075" (1.90mm)
Manufacturer Size Code
V
Features
Polymer
Voltage Rating
2.5 Volts
Esr
25 mOhms
Operating Temperature Range
- 55 C to + 105 C
Dimensions
4.3 mm W x 7.3 mm L x 1.9 mm H
Dissipation Factor Df
10
Lead Spacing
1.3 mm
Leakage Current
83 uAmps
Product
Tantalum Organic Polymer Low ESR
Ripple Current
0.7 Amps
Termination Style
SMD/SMT
Capacitance Tolerance
± 20%
Capacitor Case Style
2917
Msl
MSL 3 - 168 Hours
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
399-4105-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
T520V337M2R5ATE025
Manufacturer:
Amphenol
Quantity:
2 100
Company:
Part Number:
T520V337M2R5ATE025
Manufacturer:
KEMET
Quantity:
26 000
KEMET Organic Capacitor (KO-CAP) – T520 Series Polymer Tantalum
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase reflow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for convection and IR reflow reflect
the profile conditions of the IPC/J-STD-020D standard for moisture
sensitivety testing. The devices can safely withstand a maximum of
three reflow passes at these conditions.
Note that although the X/7343-43 case size can withstand wave
soldering, the tall profile (4.3mm maximum) dictates care in wave
process development.
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Time 25°C to peak temperature
Silver Paint
Time within 5°C of max peak
Liquidous temperature (T
Time (t
Ramp-down rate (T
Time above liquidous (t
Temperature Max (T
Profile Feature
Temperature Min (T
Ramp-up rate (T
Peak Temperature (T
Leadframe
(-Cathode)
temperature (t
Preheat/Soak
Polymer /Ta
s
) from T
smin
L
to T
to T
P
P
)
to T
Smin
Smax
smax
P
P
L
)
)
)
)
)
L
L
)
)
)
2
O
Carbon
5
/Ta
Sn-Pb Assembly
6 minutes max
3°C/sec max
6°C/sec max
20 sec max
60-120 sec
60-150 sec
Tantalum Wire
235°C**
220°C*
100°C
150°C
183°C
Pb-Free Assembly
Silver Adhesive
Weld
8 minutes max
3°C/sec max
6°C/sec max
30 sec max
60-120 sec
60-150 sec
260°C**
250°C*
150°C
200°C
217°C
Washer
Leadframe
(+Anode)
T
T
25
smax
smin
T
T
P
L
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
Time/Temperature Soldering Profile
25° C to Peak
t
S
Time
T2015-1 • 1/10/2011
t
L
t
P
16 16