HSEC8-110-01-SM-DV-A Samtec Inc, HSEC8-110-01-SM-DV-A Datasheet
HSEC8-110-01-SM-DV-A
Manufacturer Part Number
HSEC8-110-01-SM-DV-A
Description
CONN EDGE CARD DUAL .8MM 20POS
Manufacturer
Samtec Inc
Series
Edge Rate™ HSEC8r
Specifications of HSEC8-110-01-SM-DV-A
Gender
Female
Card Type
Dual Edge
Card Thickness
0.062" (1.57mm)
Number Of Positions
20
Pitch
0.031" (0.80mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Color
Black
Row Pitch
1.75mm
Pitch Spacing
0.8mm
No. Of Contacts
20
Contact Termination
Surface Mount Vertical
No. Of Rows
2
Contact Plating
Gold
Connector Type
Card Edge
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SAM8079
VERTICAL EDGE RATE
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?HSEC8-DV
Insulator Material:
Black Liquid
Crystal Polymer
Contact:
BeCu
Plating:
Au or Sn over 50µ"
(1,27µm) Ni
Current Rating:
3.1A @ 30°C Temperature Rise
(See website for details)
Operating Temp:
-55°C to +125°C
Card Insertion Depth:
(3,15mm) .125" nominal
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (10-60)
Note: Some lengths, styles
and options are non-standard,
non-returnable.
F-211
SPECIFIC OPTION
• Samtec supplied card
• Specialty
• Custom cards for low-cost
SPECIFICATIONS
• Standard high speed
HSEC8-DV SERIES
CUSTOM CARDS
(0,80mm) .0315"
layout/artwork to make
your own
cards
card
shapes
interface cards for 19mm,
25mm & 30mm mated
heights, single-ended &
differential applications.
See HSC8 Series.
stack height customization
pass-through options.
APPLICATION
STANDARD &
AVAILABLE
Guide rails and
Call Samtec.
Mates with:
1,60mm thick cards,
ECDP, HSC8, HSF8
HSEC8
0,80mm HSEC8
7,98mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
For complete test data go to www.samtec.com?HSEC8-DV
or contact sig@samtec.com
(7,80)
.307
(1,32)
.052
A
02
01
10, 13, 20, 25, 30, 37,
01
02
No. of Positions x (0,80) .0315 + (7,80) .307
40, 49, 50, 60
D
(0,80) .0315 + (4,60) .181
(0,80) .0315 + (2,20) .087
No. of Positions x
No. of Positions x
THICKNESS
10, 20 & 30
1
CARD
–01
–03
POSITIONS
Rated @ 3dB Insertion Loss
(1,12) .044 DIA
PER ROW
(0,80) .0315
E
10.5 GHz / 21 Gbps
8 GHz / 16 Gbps
WWW.SAMTEC.COM
WWW.SAMTEC.COM
(1,75) .070 (5,60) .220 (7,00) .276
(2,54) .100 (6,39) .252 (7,79) .307
®
A
™
HSEC8–149–01–L–DV–A
B
™
(7,98)
.314
B C
THICKNESS
CARD SOCKET
= (1,60mm) .062"
= (2,36mm) .093"
thick card
thick card
CARD
C
–01
–03
(7,98)
.314
(4,25)
POSITIONS
Positions where no dimensions are given
do not have keying feature.
*Mates with ECDP Series.
.167
PER ROW
13*
25*
37*
49*
40
50
60
Note: Other Gold plating
options available.
Contact Samtec.
PLATING
OPTION
–BL
Alignment
Pins
(26,90) 1.059 (52,60) 2.071
(18,10) .713 (34,20) 1.346
(18,90) .744 (36,60) 1.441
(22,90) .902 (43,80) 1.724
(22,90) .902 (44,60) 1.756
(6,10) .240
(6,10) .240
Gold on contact,
= 10µ" (0,25µm)
Matte Tin on tail
D
–L
HSEC8–125–01–L–DV–A
(15,00) .591
(24,60) .969
HIGH SPEED CABLE &
–EM to –DV
FLEX APPLICATIONS
DV
E
BOARD-TO-BOARD
–L1
APPLICATIONS
–DV to HSF8
–DV to ECDP
CONNECTOR CABLE*
–DV to –DV
HSEC8–113
HSEC8–125
HSEC8–137
HSEC8–149
= (5,50mm) .217" DIA
(Other sizes available.
A
(For use with ECDP.)
• Board lock option
• Latch option
(13, 25, 37, 49 only)
= Latching Option
Pick & Place Pad
Contact Samtec.)
Polyimide Film
(40, 50, 60 only)
= Board Locks
= Tape & Reel
Packaging
= Weld tab
–WT
–TR
–BL
–L1
–K
OPTION
OTHER
PCB to –DV
ECDP–08
ECDP–16
ECDP–24
ECDP–32
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