ESD7C3.3DT5G ON Semiconductor, ESD7C3.3DT5G Datasheet - Page 4
![DIODE ESD PROT 3.3V SOT-723](/photos/5/30/53079/sot-723_631aa_sml.jpg)
ESD7C3.3DT5G
Manufacturer Part Number
ESD7C3.3DT5G
Description
DIODE ESD PROT 3.3V SOT-723
Manufacturer
ON Semiconductor
Datasheet
1.ESD7C3.3DT5G.pdf
(4 pages)
Specifications of ESD7C3.3DT5G
Voltage - Reverse Standoff (typ)
3.3V
Voltage - Breakdown
5V
Polarization
2 Channel Array - Unidirectional
Mounting Type
Surface Mount
Package / Case
SOT-723
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Other names
ESD7C3.3DT5GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ESD7C3.3DT5G
Manufacturer:
ON Semiconductor
Quantity:
36 470
Company:
Part Number:
ESD7C3.3DT5G
Manufacturer:
ON Semiconductor
Quantity:
1 650
Company:
Part Number:
ESD7C3.3DT5G
Manufacturer:
ON
Quantity:
30 000
Company:
Part Number:
ESD7C3.3DT5G
Manufacturer:
ON
Quantity:
30 000
Part Number:
ESD7C3.3DT5G
Manufacturer:
ON/安森美
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
b1
1
e
3
D
2
-X-
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
E
b
2X
0.08 (0.0032)
-Y-
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
X
Y
0.0157
0.40
A
0.0157
0.0157
0.40
0.40
ESD7C3.3DT5G SERIES
L
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81-3-5773-3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
C
H
http://onsemi.com
CASE 631AA-01
E
SOT-723
ISSUE C
4
0.0157
0.40
0.0157
0.40
SCALE 20:1
0.039
1.0
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
Y14.5M, 1982.
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
FLASH, PROTRUSIONS OR GATE BURRS.
DIM
H
b1
A
b
C
D
E
L
e
inches
E
mm
MIN
0.45
0.15
0.25
0.07
1.15
0.75
1.15
0.15
MILLIMETERS
0.40 BSC
NOM
0.50
0.21
0.31
0.12
1.20
0.80
1.20
0.20
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
0.55
0.27
0.37
0.17
1.25
0.85
1.25
0.25
0.0059 0.0083 0.0106
0.0028 0.0047 0.0067
0.0059 0.0079 0.0098
MIN
0.018
0.010
0.045
0.045
0.03
0.016 BSC
INCHES
NOM
0.020
0.012
0.047
0.032
0.047
ESD7C3.3D/D
MAX
0.022
0.015
0.049
0.034
0.049