NUP1301ML3T1G ON Semiconductor, NUP1301ML3T1G Datasheet - Page 2

• Manufacturer Part Number: NUP1301ML3T1G
• Description: IC DIODE ARRAY LOCAP ESD SOT-23
• Manufacturer: ON Semiconductor

Specifications of NUP1301ML3T1G

• Voltage - Reverse Standoff (typ): 70V
• Voltage - Breakdown: 70V
• Polarization: 2 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Product: Standard Recovery Rectifier
• Configuration: Dual Series
• Reverse Voltage: 70 V
• Forward Voltage Drop: 1.25 V @ 0.15 A
• Forward Continuous Current: 0.715 A
• Max Surge Current: 0.45 A
• Reverse Current Ir: 2.5 uA
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NUP1301ML3T1G; NUP1301ML3T1GOSTR

Product Bulletin #16134
3.
Parts with a smooth bottom surface finish have been attributed with higher failure rates as compared to failure rates
of parts with a matte finish. A matte finish has more surface area for the glue to adhere to as compared to a part
with a smooth surface. As a containment action, ON Semiconductor has placed shipment holds on any inventories
of smooth parts and has notified some customers who have received smooth parts.
We also suspended manufacturing on mold systems that produce smooth parts to have those mold systems
enhanced to produce parts with a matte surface finish. These containment actions have temporarily affected our
capacity but have been resolved and we have returned to full capacity.
The enhanced matte surface is designed to overcome any variability of the mold compound and aids in a
containment action until we can eliminate that variability.
What to do next?
If you have consumed product starting from date code 0814 and have not experienced any component placement
issues on your boards, you should not be affected. Product reliability is not a concern as parts either solder
normally or they don’t.
If you have a manufacturing process that consists of gluing these components to the bottom side of a board in a
wave solder process and have experienced components falling off boards with a greater than normal frequency,
please contact your ON Semiconductor Customer Service Representative or Salesperson to facilitate product
replacement or contact a technical representative to further discuss the issue for containment or other actions.
For technical assistance, please contact:
Asia Pacific/Japan:
Stephen Ng
ON Semiconductor Quality
Phone: [phone]
Email:
United States:
Mark Wasilewski
ON Semiconductor Quality
Phone: [phone]
Email:
Europe:
Herve Marchionini
ON Semiconductor Quality,
Phone: [phone]
Email:
Issue Date: 11 Jul 2008
Surface finish of parts
[e-mail]
[e-mail]
[e-mail]
Rev.07-02-06
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