TMK063CG820JP-F Taiyo Yuden, TMK063CG820JP-F Datasheet - Page 14
![CAP CER 82PF 25V C0G 0201](/photos/10/51/105197/emk_tmk_series_0201_sml.jpg)
TMK063CG820JP-F
Manufacturer Part Number
TMK063CG820JP-F
Description
CAP CER 82PF 25V C0G 0201
Manufacturer
Taiyo Yuden
Series
TMKr
Datasheet
1.UMK105CG100DV-F.pdf
(17 pages)
Specifications of TMK063CG820JP-F
Capacitance
82pF
Voltage - Rated
25V
Tolerance
±5%
Temperature Coefficient
C0G, NP0
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
0201 (0603 Metric)
Size / Dimension
0.024" L x 0.012" W (0.60mm x 0.30mm)
Thickness
0.30mm
Lead Free Status / RoHS Status
Not applicable / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
587-1172-2
RM TMK063 CG820JP-F
RM TMK063 CG820JP-F
Precautions on the use of Multilayer Ceramic Capacitors
△
3.Considerations for auto-
!
PRECAUTIONS
matic placement
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Stages
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the ca-
2. The maintenance and inspection of the mounters should be
Selection of Adhesives
1. Mounting capacitors with adhesives in preliminary assembly,
pacitors when mounting onto the PC boards.
conducted periodically.
before the soldering stage, may lead to degraded capacitor
characteristics unless the following factors are appropriately
checked; the size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening period.
Therefore, it is imperative to consult the manufacturer of the
adhesives on proper usage and amounts of adhesive to use.
Precautions
(1) The lower limit of the pick-up nozzle should be adjusted to the surface level of the
(2) The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3) To reduce the amount of deflection of the board caused by impact of the pick-up
(1) Required adhesive characteristics
(2) The recommended amount of adhesives is as follows;
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
1. Some adhesives may cause reduced insulation resistance. The difference between
a. The adhesive should be strong enough to hold parts on the board during the mount-
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
PC board after correcting for deflection of the board.
nozzle, supporting pins or back-up pins should be used under the PC board. The fol-
lowing diagrams show some typical examples of good pick-up nozzle placement:
Double-sided
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
the shrinkage percentage of the adhesive and that of the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much
adhesive applied to the board may adversely affect component placement, so the fol-
lowing precautions should be noted in the application of adhesives.
ing & solder process.
Single-sided
mounting
mounting
Figure
a
b
c
△
!
Not recommended
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
Adhesives should not contact the pad
Technical considerations
212/316 case sizes as examples
100 ∼120 μm
0.3mm min
Recommended
3/6
113
4