C1210C106K3RALTU Kemet, C1210C106K3RALTU Datasheet - Page 3
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C1210C106K3RALTU
Manufacturer Part Number
C1210C106K3RALTU
Description
CAP CER 10UF 25V X7R 1210
Manufacturer
Kemet
Datasheet
1.C1210C106K3RALTU.pdf
(7 pages)
Specifications of C1210C106K3RALTU
Capacitance
10µF
Voltage - Rated
25V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
1210 (3225 Metric)
Size / Dimension
0.138" L x 0.102" W (3.50mm x 2.60mm)
Thickness
2.50mm
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
C1210C106K3RAL
C1210C106K3RAL7800
C1210C106K3RAL7800
Y
X
placement
courtyard
Grid
330mm (13.00")
178mm (7.00")
Tape & Reel Packaging
or
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Z
C
G
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Case Sizes 1210 are 12 mm tape with 8 mm pitch.
Case Sizes
Note: TU suffix represents tape and reel packaging of unmarked components.
CERAMIC CHIP CAPACITORS
TM suffix represents tape and reel packaging of marked components.
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
1210 are 8 mm tape with 4 mm pitch.
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
(.315 .012")
(.472 .012")
Packaging Information
12mm .30
8mm .30
or
available on punched paper only.
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
Anti-Static Reel
Z
0402 and 0603 case sizes
Embossed Carrier*
* Punched paper carrier used for 0402 and 0603 case size.
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
G
Reflow Solder
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
and page 87 for MIL-PRF-55681 chips.
for details on reeling quantities for commercial chips
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
X
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Y(ref)
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
g
C(ref)
1.21
1.73
2.00
3.00
3.00
4.10
4.10
5.15
5.15
(except 1825 Commercial, and 1825 & 2225 Military)
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
3.18
3.70
4.90
4.90
Z
Embossment
0.68
0.70
1.50
1.50
G
Not Recommended
Not Recommended
Wave Solder
0.80
1.10
1.40
2.00
X
Y(ref)
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20
93