T495D226M025ATE200 Kemet, T495D226M025ATE200 Datasheet - Page 14

• Manufacturer Part Number: T495D226M025ATE200
• Description: CAP TANT 22UF 25V 20% SMD
• Manufacturer: Kemet
• Series: T495r
• Type: Moldedr

Specifications of T495D226M025ATE200

• Capacitance: 22µF
• Voltage - Rated: 25V
• Tolerance: ±20%
• Esr (equivalent Series Resistance): 200.0 mOhm
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 2917 (7343 Metric)
• Size / Dimension: 0.287" L x 0.169" W (7.30mm x 4.30mm)
• Height: 0.110" (2.80mm)
• Manufacturer Size Code: D
• Features: General Purpose
• Voltage Rating: 25 Volts
• Esr: 200 mOhms
• Operating Temperature Range: - 55 C to + 125 C
• Mfr Case Code: D Case
• Dimensions: 4.3 mm W x 7.3 mm L x 2.8 mm H
• Lead Spacing: 1.3 mm
• Leakage Current: 5.5 uAmps
• Product: Tantalum Solid Low ESR Standard Grade
• Ripple Current: 346 mAmps
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-5263-2

Low ESR MnO
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The
positive terminal is identified on the capacitor body by a stripe plus in some cases a beveled edge. A small degree of transient reverse
voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within
these limits.
Table 2 – Land Dimensions/Courtyard
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
¹ Height of these chips may create problems in wave soldering.
² Land pattern geometry is too small for silkscreen outline.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
KEMET
Case
E¹
X¹
Temperature
C
D
A
B
T
V
125° C
25° C
85° C
2
7343-31
7260-38
7343-20
7343-43
Metric
3216-18
3528-19
6032-28
3528-12
Code
Tantalum Surface Mount Capacitors – T495 Surge Robust Low ESR MnO
Size
EIA
1.35
2.35
2.35
2.55
4.25
2.35
2.55
2.55
Permissible Transient Reverse Voltage
X
Maximum (Most) Land
2.65
2.65
2.15
2.15
3.75
2.15
3.75
3.75
Density Level A:
Protrusion (mm)
Y
15% of Rated Voltage
5% of Rated Voltage
1% of Rated Voltage
2.60
3.20
1.45
1.45
2.70
1.45
2.70
2.70
C
10.20
10.20
10.20
10.10
8.90
6.10
6.10
6.10
V1
2.80
4.00
4.40
5.50
7.20
4.00
5.50
5.50
V2
1.25
2.25
2.25
2.45
2.25
2.45
2.45
4.15
X
Median (Nominal) Land
2.25
3.35
2.25
3.35
3.35
1.75
1.75
1.75
Density Level B:
Protrusion (mm)
Y
2
Series
2.50
2.60
3.30
2.60
2.60
1.35
1.35
1.35
C
5.00
5.00
5.00
7.80
9.10
9.40
9.10
9.10
V1
3.90
2.30
3.50
5.00
6.70
3.50
5.00
5.00
V2
2.35
4.05
2.35
2.35
1.15
2.15
2.15
2.15
X
Minimum (Least) Land
1.35
1.35
1.85
2.95
1.85
1.35
2.95
2.95
Density Level C:
Protrusion (mm)
Y
T2009-1 • 1/17/2011
1.25
1.25
2.40
2.50
3.00
1.25
2.50
2.50
C
6.90
8.20
8.20
8.20
4.10
4.10
8.10
4.10
V1
2.00
3.20
3.60
6.40
3.20
4.70
4.70
4.70
V2
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