DEMO9S08DZ60 Freescale Semiconductor, DEMO9S08DZ60 Datasheet - Page 405
DEMO9S08DZ60
Manufacturer Part Number
DEMO9S08DZ60
Description
BOARD DEMO
Manufacturer
Freescale Semiconductor
Type
MCUr
Datasheets
1.DEMO9S08DZ60.pdf
(416 pages)
2.DEMO9S08DZ60.pdf
(1 pages)
3.DEMO9S08DZ60.pdf
(16 pages)
4.DEMO9S08DZ60.pdf
(2 pages)
5.DEMO9S08DZ60.pdf
(1 pages)
Specifications of DEMO9S08DZ60
Contents
Board, Cable, CD
Processor To Be Evaluated
MC9S08DZ60
Interface Type
RS-232, USB
Silicon Manufacturer
Freescale
Core Architecture
HCS08
Core Sub-architecture
HCS08
Silicon Core Number
MC9S08
Silicon Family Name
S08D
Kit Contents
MC9S08DZ60 Board, Software, Cables, Connectors
Rohs Compliant
Yes
For Use With/related Products
MC9S08DZ60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- DEMO9S08DZ60 PDF datasheet
- DEMO9S08DZ60 PDF datasheet #2
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- DEMO9S08DZ60 PDF datasheet #5
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Appendix C
Ordering Information and Mechanical Drawings
C.1
This section contains ordering information for MC9S08DZ60 Series devices.
Example of the device numbering system:
C.1.1
C.2
The following pages are mechanical drawings for the packages described in the following table:
Freescale Semiconductor
(MC = Fully Qualified)
1
Ordering Information
Mechanical Drawings
(S = Auto Qualified)
See
MC9S08DZ60 Series Devices
Device Number
(9 = Flash-based)
MC9S08DZ60
MC9S08DZ48
MC9S08DZ32
MC9S08DZ16
Table C-2
Memory
Status
Family
Core
for package information.
Table C-1. Devices in the MC9S08DZ60 Series
MC
FLASH
60,032
49,152
33,792
16,896
MC9S08DZ60 Series Data Sheet, Rev. 4
9 S08
Approximate Flash
size in KB
DZ
Memory
4096
3072
2048
1024
RAM
60
F1
M
XX
EEPROM
2048
1536
1024
512
Temperature range
Package designator (see
Mast Set Identifier
Only appears for “Auto Qualified” part numbers
beginning with “S”
F1 = 1M74K mask set
(C = –40°C to 85°C)
(V = –40°C to 105°C)
(M = –40°C to 125°C)
Available Packages
48-LQFP, 32-LQFP
48-LQFP, 32-LQFP
64-LQFP,
Table
1
C-2)
405
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